A liquid ejection head includes an element substrate having an energy-generating element configured to generate an energy for ejecting a liquid from an ejection orifice, a support member for supporting the element substrate, the support member including a liquid chamber formed therein to supply the liquid to the ejection orifice, and a damper portion for absorbing vibration of the liquid inside the liquid chamber, the damper portion being flexible. The support member has a through-hole for communicating with the liquid chamber at a position located above the liquid chamber in a vertical direction when the liquid ejection head is in a use orientation. The damper portion has a taper portion that tapers downwardly in the vertical direction and is positioned in such a manner that the tapering portion closes the through-hole, and the damper portion and the support member are attached to each other by a fixing member.

A recording element substrate is bonded to an FPC in at least a part of a region of a second face between a liquid supply port and an edge of the recording element substrate, and an electric connection part is provided in which a wiring conductor and a pad are electrically connected to each other by a bonding wire.

A liquid ejection head includes an ejection opening; a passage in which an energy generation element is disposed; an ejection opening portion that allows communication between the ejection opening and the passage; a supply passage for allowing the liquid to flow into the passage; and an outflow passage for allowing the liquid to flow out to the outside. An expression of H.sup.−0.34×P.sup.−0.66×W>1.7 is satisfied when a height of the passage is set to H [μm], a length of the ejection opening portion is set to P [μm], and a length of the ejection opening portion is set to W [μm].

A liquid ejecting head has a laminated flow path member on which a supply flow path for individually supplying a plurality of liquids to an element substrate and a collection flow path for individually collecting the liquids are formed. The supply flow path includes first and second common supply flow paths for horizontally leading first and second liquids to positions corresponding to a plurality of element substrates. The first and second common supply flow paths are formed in the same layer of the laminated flow path member. The collection flow path includes a first common collection flow path for horizontally collecting the first liquid and a second common collection flow path for horizontally collecting the second liquid from positions corresponding to the plurality of element substrates. The first and second common collection flow paths are formed in the same layer of the laminated flow path member.

A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones. A nozzle plate in formed on the channel layer by forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones.

A liquid ejection head includes a substrate; an energy generating member provided on the substrate to generate energy for liquid ejection; a terminal part provided on the substrate to be electrically connected with an outside, the terminal part including at least an electrode for supplying electric power to the energy generating member; a wiring layer provided on the substrate to electrically couple the energy generating member and the electrode; a nozzle member provided on the substrate, the nozzle member including a liquid ejection port and a liquid flow path, the liquid ejection port being arranged to correspond to the energy generating member, and the liquid flow path communicating with the liquid ejection port; and a metal structure provided to cover the wiring layer in a region where neither the nozzle member nor the electrode is provided, and the metal structure is electrically independent of the terminal part.

A fluid dispenser, comprising a dispenser faceplate having at least one ejection port and a dispenser guard. The dispenser guard has at least one opening configured to allow fluid exiting from the ejection port to flow through and at least one drainage structure. The dispenser guard is spaced from the ejection port with a gap small enough to attract the fluid accumulated around the ejection port to flow into the drainage structure.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

An element substrate used in a liquid discharge head that discharges liquid to a recording material includes a substrate, an energy generating element that generates energy used to discharge the liquid, circuit wiring that has an electrode portion for external electrical connection and that drives the energy generating element, and that is implemented on the substrate, a first protective film layer that has an opening portion for exposing the electrode portion and that covers the circuit wiring, an electroplating ground layer formed on the electrode portion, and an electroplated bump layer made of a metal material formed on the electroplating ground layer. A bent portion is formed in the first protective film layer by the first protective film layer covering a protruding portion that the circuit wiring has. A second protective film layer is formed on the first protective film layer and covers the bent portion.

A liquid ejection head includes a recording element substrate, a flow path member having a common supply flow path and a common collection flow path through which a liquid having a temperature higher than a temperature of the common supply flow path flows, and a support member supporting the flow path member. The common supply flow path and the common collection flow path are formed to extend along a longitudinal direction of the flow path member and be arranged side by side with each other in a lateral direction of the flow path member. The positions of the flow path member in the longitudinal direction and in the lateral direction are defined at a center portion in the longitudinal direction, and at a side surface located on the common supply flow path side in the lateral direction, among side surfaces extending in the longitudinal direction, respectively.