A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes plural ink-drop generators produced by the semiconductor process and formed on the chip substrate. The ink-drop generators are arranged in a longitudinal direction to form plural longitudinal axis array groups having a pitch maintained between two adjacent ink-drop generators in the longitudinal direction, and arranged in a horizontal direction to form plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches maintained between two adjacent ink-drop generators in the horizontal direction.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

Misalignment of printing positions is reduced in a print head that circulates an ink between a printing apparatus and the print head in a case where the misalignment is apt to change dynamically along with heat deformation. To this end, printing element substrates in the print head are adjusted to a target temperature and then a liquid is circulated through the print element substrates. After thermal expansion of the print head reaches a steady state, an amount of misalignment of printing positions in a direction of conveyance of the print head is obtained by using a test pattern printed by using printing elements. Further, a correction value for correcting the misalignment of the printing positions is set based on the obtained amount of misalignment of the printing positions.

Misalignment of printing positions between print heads associated with thermal expansion is reduced without increasing a data processing load. To this end, printing element substrates in a reference head and an adjustment target head are adjusted to a target temperature, and a liquid is circulated through the print element substrates. After thermal expansion of the reference head and the adjustment target head reaches a steady state, a first printing region being a printing region of the reference head and a second printing region being a printing region of the adjustment target head in a longitudinal direction are obtained from an image printed by using all printing elements. Then, used regions to be used for actual printing are set among the printing elements arranged on the reference head and the adjustment target head based on the first printing region and the second printing region.

A recording element substrate for a liquid ejection head is provided with a storage section including an antifuse element and a first resistor connected in parallel with the antifuse element, and a second resistor that is connected in parallel with the storage section and serves as a reference in rating information of the antifuse element, and a second switch connected to the second resistor.

A liquid discharge head includes an actuator substrate including a pressure chamber communicating with a nozzle from which a liquid is to be discharged and a pressure generator to apply pressure to the liquid in the pressure chamber, a frame bonded to the actuator substrate and having a through hole filled with a resin, and a temperature detector inserted into the through hole and attached to the actuator substrate with the resin to detect a temperature of the actuator substrate. The through hole has a first face facing the actuator substrate and a second face opposite to the first face and facing an opening of the frame. The resin in the through hole includes an uncured portion uncured and facing the first face and a cured portion cured and facing the second face. The uncured portion contacts the actuator substrate and is between the cured portion and the actuator substrate.

An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten μm to two hundred μm, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.

There is provided a liquid ejecting unit that ejects liquid from a plurality of nozzles, in which the planar shape of the ejecting face on which the nozzles are formed is a shape in which a first portion that passes through the center line parallel to the long side of the rectangle of the minimum area including the ejecting face and a second portion that does not pass through the center line are arranged in the direction of the long side.