A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

A liquid ejection head circuit board including a substrate, a heat generating resistance element that generates heat energy used for ejection of liquid, an electric wiring layer that is electrically connected to the heat generating resistance element, and an insulating film that insulates the electric wiring layer. The insulating film includes a first insulating film and a second insulating film on the first insulating film, the first insulating film is a first SiOCN film, and the second insulating film is a second SiOCN film containing more carbon than the first SiOCN film or a low-density insulating film with a lower density than the first SiOCN film.

A liquid ejecting head including: an individual flow path row in which a plurality of individual flow paths communicating with a nozzle that ejects a liquid in a first axis direction are arranged in parallel along a second axis orthogonal to a first axis, and a first common liquid chamber communicating with the plurality of individual flow paths, in which each of the plurality of individual flow paths has a pressure chamber that stores a liquid.

A liquid ejecting head including: an individual flow path row in which a plurality of individual flow paths communicating with a nozzle that ejects a liquid in a first axis direction are arranged in parallel along a second axis orthogonal to a first axis, and a first common liquid chamber communicating with the plurality of individual flow paths, in which each of the plurality of individual flow paths has a pressure chamber that stores a liquid.

A droplet discharging head executes multi-path recording in which dot recording in one main scanning line is completed by n main scans when n is an integer of 2 or more. The droplet discharging head includes: a plurality of nozzles configured to discharge a liquid as droplets; a pressure chamber defining substrate defining a pressure chamber communicating with the nozzles; a piezoelectric element including a first electrode, a second electrode, and a piezoelectric layer containing a perovskite-type composite oxide containing K, Na, and Nb as a main component; and a vibration plate forming a part of a wall surface of the pressure chamber and configured to vibrate by driving of the piezoelectric element. The number of paths n in the multi-path recording, a piezoelectric constant d.sub.31 [m/v] of the piezoelectric element, and a ratio x of a Na molar fraction to a total value of a K molar fraction and the Na molar fraction in the piezoelectric layer satisfy a relationship represented by a formula (1).

In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

An apparatus includes a reservoir and a printhead. The printhead includes a support structure including a deformable portion defining at least a top surface of a pumping chamber, a flow path extending from the reservoir to the pumping chamber to transfer fluid from the reservoir to the pumping chamber, and an actuator disposed on the deformable portion of the support structure. A trench is defined in a top surface of the actuator. Application of a voltage to the actuator causes the actuator to deform along the trench, thereby causing deformation of the deformable portion of the support structure to eject a drop of fluid from the pumping chamber.

A liquid ejection head includes a recording element substrate, a flow path member having a common supply flow path and a common collection flow path through which a liquid having a temperature higher than a temperature of the common supply flow path flows, and a support member supporting the flow path member. The common supply flow path and the common collection flow path are formed to extend along a longitudinal direction of the flow path member and be arranged side by side with each other in a lateral direction of the flow path member. The positions of the flow path member in the longitudinal direction and in the lateral direction are defined at a center portion in the longitudinal direction, and at a side surface located on the common supply flow path side in the lateral direction, among side surfaces extending in the longitudinal direction, respectively.

A circulation channel for circulating liquid, which is configured at least with an ejection unit, a first pressure adjusting unit, a second pressure adjusting unit, a pump, and a temperature adjusting unit, is included, and, in the circulation channel, liquid supplied from the outside flows into the first pressure adjusting unit and then is flowed out of the first pressure adjusting unit into the ejection unit and the second pressure adjusting unit, the liquid flowed out of the ejection unit and the liquid flowed out of the first pressure adjusting unit flow into the second pressure adjusting unit and then are flowed out of the second pressure adjusting unit into the pump, the pump sends the liquid flowed out of the second pressure adjusting unit to the first pressure adjusting unit, and the temperature of the circulating ink is adjusted by the temperature adjusting unit.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.