A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

A flexible printed circuit board whose end part side is connected to a print element substrate capable of ejecting ink using a print element, so as to be capable of transmitting a signal from a control part of a printing apparatus to the print element substrate via wiring and to be capable of transmitting a signal from the print element substrate to the control part via the wiring, wherein a side part side of high-potential wiring includes at least one of a regulation part that regulates penetration of ink and a wiring part that is configured with low-potential ground wiring and low-potential liquid signal line whose signal value transmitted by the control part or operation based on a signal is monitored.

A liquid ejection head including a base substrate, an ejection port to eject a liquid, a heating element formed above the base substrate that heats the liquid to eject the liquid from the ejection port, a temperature detection element formed above the base substrate that detects a temperature of the liquid, a wiring layer connected to the heating element, a protective layer formed on the base substrate that protects the heating element and the wiring layer from the liquid, and a liquid supply port that penetrates the base substrate and supplies the liquid to the ejection port. When viewed in a direction perpendicular to the base substrate, the temperature detection element is disposed between the heating element and the liquid supply port, and the temperature detection element is formed on the protective layer.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.

According to the present invention, it is possible to provide an element substrate and a print head with which a decrease in yield and an increase in cost in a manufacturing process can be suppressed. For that purpose, a VH wiring line and a GNDH wiring line are provided in parallel in the same layer.

One embodiment of the present invention is a liquid ejection apparatus having: a liquid ejection head including a heating element, a first protection layer that blocks contact between the heating element and liquid, a second protection layer that partially covers the first protection layer and functions as a first electrode, a second electrode that is electrically connected to the first electrode through the liquid, and an ejection port that ejects the liquid; and a control unit configured to perform control of setting a potential difference between the first electrode and the second electrode to a predetermined value in each of aging and printing by changing at least one of potentials of the first electrode and the second electrode, wherein ΔVa≠ΔVp is satisfied in the case where the potential difference in the aging is represented by ΔVa and the potential difference in the printing is represented by ΔVp.

A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

Examples include a fluidic die. The fluidic die comprises an array of field effect transistors. Connecting members electrically connect at least some of the field effect transistors of the array of field effect transistors, and the field effect transistors of the array are arranged into respective sets of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having a first number of field effect transistors. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a second number of field effect transistors that is different than the first number of field effect transistors.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.