A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

A liquid discharge head substrate includes a first heater row including a plurality of heaters arranged in a first direction, a first transistor configured to drive a first heater of the plurality of heaters, and a second transistor configured to drive the first heater. The first heater is arranged between the first transistor and the second transistor in a second direction crossing the first direction.

A print head assembly comprises a print head unit, a cooling duct, and a blower arranged to pass a gaseous cooling medium through the cooling duct.

The cooling duct has an elongated closed hollow cross-section bounded on at least one side by a flat wall. The print head unit is attached to the flat wall outside of the cooling duct such that the print head unit is cooled by the gaseous medium passing through the cooling duct via thermal contact through the flat wall of the cooling duct.

The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

A method of operating a printing device during a power loss event includes, with a power loss protection supply voltage generator coupled to a printhead driving circuit, maintaining a power loss protection supply voltage (V.sub.DD—plp) to the printhead driving circuit until a high voltage power supply (V.sub.PP) to the high voltage devices drops below a threshold voltage.

Provided is a liquid ejecting head which includes a head main body which has liquid ejection surface through which liquid is ejected, a flexible wiring substrate which is connected to the head main body, and a flow-path member having flow path through which liquid is supplied to the head main body. The flow-path member has an opening portion through which the substrate is inserted. The substrate extends to the flow-path member, with respect to the head main body. The substrate is inclined in a direction directed toward a first surface side of both surfaces of the substrate. In an area on a second surface side of both surfaces of the substrate, the flow path has a portion extending along the head main body.

A fluidic die includes fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage. The fluidic die further includes monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including a connection structure and a select transistor and a pulldown transistor connected to the electrode via the connection structure. The connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.

A semiconductor device is provided. The device comprises: a first transistor that includes a first primary terminal, a second primary terminal and a first control terminal; a second transistor that includes a third primary terminal, a fourth primary terminal and a second control terminal; and a resistive element. The first and third primary terminal are connected to a first voltage line. The second primary terminal and one terminal of the resistive element are connected to a second voltage line. The first and second control terminal, the fourth primary terminal and the other terminal of the resistive element are connected to a node. A potential change in the third primary terminal is transmitted to the first control terminal by capacitive coupling between the third primary terminal and the node, turning on the first transistor.

A liquid ejecting head unit includes an ejecting surface in which nozzles for ejecting a liquid are formed, and a first and a second circuit substrates for ejecting the liquid from the nozzles, in which a planar shape of the ejecting surface includes a first, a second and a third portions. A center line parallel to a long side of a rectangle of a minimum area surrounding the ejecting surface passes the first portion but not the second and third portions. The second and third portions are arranged adjacently to the first portion interposed therebetween. The first circuit substrate is positioned in the first and second portions. The second circuit substrate is positioned in at least one of the first and third portions.

An inkjet head includes a head chip and an ink chamber. The head chip has a nozzle substrate provided with nozzles which discharge ink. The ink chamber is located over the head chip. In the ink chamber, the ink to be supplied to the nozzles is stored. The inkjet head is mounted on a mounting member. Between the nozzle substrate and the ink chamber, the inkjet head has a position reference substrate provided with butting parts. The butting parts are butted against the mounting member to position the inkjet head when the inkjet head is mounted on the mounting member.