A liquid ejection head includes a nozzle surface having a plurality of nozzles, a channel structure stacked on the nozzle surface in a stacking direction, and a supply channel structure formed of a material having a lower thermal conductivity than a material of the channel structure. The channel structure has a liquid ejection channel communicating with the nozzles. The supply channel structure has a supply channel communicating with the liquid ejection channel. The supply channel structure has a covering portion covering at least a portion of an end surface on a side of the channel structure in a width direction orthogonal to the stacking direction.

In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

A print element substrate, comprising a base, a heater provided on the base and configured to generate heat used to discharge ink, a flow path member, which forms an ink flow path, configured to form, together with the base, a bubbling chamber in which the ink is bubbled by the heat of the heater provided in a bottom surface of the bubbling chamber, and a temperature sensor capable of detecting a temperature of the bubbling chamber, the temperature sensor being formed of the same material as the heater and provided in the same layer as the heater on the base.

A recording device includes a recording unit configured to perform recording on a medium, and a discharge tray located above the recording unit in a height direction of the recording device and configured to support the medium discharged after recording is performed thereon, and a flow path of air for cooling a cooling target is formed along a lower surface of the discharge tray. The recording unit is an example of the cooling target.

A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

A recording apparatus that performs recording on a recording medium, includes a liquid discharge head including a plurality of element substrates each having a discharge port configured to discharge liquid and a heat element configured to heat the liquid, a channel member including a common supply channel configured to communicate with the plurality of the element substrates and to supply the liquid to the plurality of the element substrates, and a common collecting channel configured to communicate with the plurality of the element substrates and to collect the liquid from the plurality of the element substrates, wherein the common supply channel and the common collecting channel are respectively disposed out of alignment in a conveyance direction of the recording medium, and wherein, upstream of the element substrates, the recording apparatus comprises a heat unit configured to heat the liquid flowing in the common supply channel.

A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

Misalignment of printing positions is reduced in a print head that circulates an ink between a printing apparatus and the print head in a case where the misalignment is apt to change dynamically along with heat deformation. To this end, printing element substrates in the print head are adjusted to a target temperature and then a liquid is circulated through the print element substrates. After thermal expansion of the print head reaches a steady state, an amount of misalignment of printing positions in a direction of conveyance of the print head is obtained by using a test pattern printed by using printing elements. Further, a correction value for correcting the misalignment of the printing positions is set based on the obtained amount of misalignment of the printing positions.

A recording apparatus that performs recording on a recording medium, includes a liquid discharge head including a plurality of element substrates each having a discharge port configured to discharge liquid and a heat element configured to heat the liquid, a channel member including a common supply channel configured to communicate with the plurality of the element substrates and to supply the liquid to the plurality of the element substrates, and a common collecting channel configured to communicate with the plurality of the element substrates and to collect the liquid from the plurality of the element substrates, wherein the common supply channel and the common collecting channel are respectively disposed out of alignment in a conveyance direction of the recording medium, and wherein, upstream of the element substrates, the recording apparatus comprises a heat unit configured to heat the liquid flowing in the common supply channel.