Provided is a liquid ejection apparatus capable of cooling a control board of a liquid ejection head without cooling a liquid supply path. Ae liquid ejection unit ejects ink onto paper. Ae control board controls the operation of the liquid ejection unit. Ae head housing covers and houses the control board inside thereof. Ae liquid supply path supplies ink to the liquid ejection head. Ae main body housing covers and houses a portion of the liquid ejection head except for the liquid ejection unit. A fan causes air to flow between the main body housing and the head housing. The liquid supply path is inserted from the outside to the inside of the main body housing in the vicinity of the liquid ejection head, and is connected to the liquid ejection head.

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

The printing apparatus includes a support part (platen) configured to support a recording medium (roll sheet), a printing part (printing unit) configured to form an image by discharging ink to a roll sheet supported on a platen while reciprocating in a main scanning direction, and a drying acceleration part configured to accelerate drying of the ink discharged by the printing unit and applied on the roll sheet in a state where the roll sheet is supported on the platen, in which a drying capacity of the drying acceleration part is higher in an end region of the platen than in a central region of the platen in a reciprocation direction of the printing unit.

A liquid ejection head includes a nozzle surface having a plurality of nozzles, a channel structure stacked on the nozzle surface in a stacking direction, and a supply channel structure formed of a material having a lower thermal conductivity than a material of the channel structure. The channel structure has a liquid ejection channel communicating with the nozzles. The supply channel structure has a supply channel communicating with the liquid ejection channel. The supply channel structure has a covering portion covering at least a portion of an end surface on a side of the channel structure in a width direction orthogonal to the stacking direction.

Provided is an ink jet recording head having a flow path member. The flow path member is made of a thermoset product of a thermosetting molding composition containing a solid epoxy resin composition containing an epoxy resin and a phenolic resin, each solid at ordinary temperatures, and an alumina filler.

A liquid ejection head includes: a first head unit; a second head unit disposed adjacent to the first head unit in a first direction and located on a first side of the first head unit in a second direction; and a heat uniforming unit shared by the first head unit and the second head unit. Each of the first head unit and the second head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. The heat uniforming unit includes a first heat uniforming member disposed on the first side of the first head unit and the second head unit in the second direction. The first heat uniforming member includes a first protrusion located next to the second head unit in the first direction and protruding toward the first head unit.

An image forming system includes an image forming unit configured to form a toner image on a recording material; a fixing device configured to fix the toner image on the recording material on which the toner image is formed by the image forming unit; a first cooling unit capable of cooling the recording material passed through the fixing device; a second cooling unit capable of cooling the recording material passed through the first cooling unit; and a control unit configured to carry out control so that during execution of an image forming job, the image forming job is stopped when both the first cooling unit and the second cooling unit are out of order and is continued when either one of the first cooling unit and the second cooling unit is out of order.

An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.