A cooling efficiency is increased. An inkjet head is provided with a head main body for jetting ink, a cooling pipe which has corrosion resistance to the ink, and through which the ink for cooling a drive circuit passes, and a cooling member which has higher thermal conductivity than that of the cooling pipe, in which at least a part of the cooling pipe is embedded, and which has recessed parts in at least a part of a portion surrounding the cooling pipe.

An electronic device including a substrate, a first electronic component provided on the substrate, a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component, a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component, and a heat sink attached to the substrate, in which the heat sink includes a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate, a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and a length of the first protruding portion in the normal direction is shorter than a length of the second protruding portion in the normal direction.

A liquid ejecting head (recording head) includes a structure (flow path member) having a plurality of stacked plates (a nozzle plate, a flow path plate, and a diaphragm) in which end surfaces at both sides in one direction are aligned. At least two plates of the plates (the nozzle plate, the flow path plate, and the diaphragm) have different coefficients of linear expansion in the one direction, and holding members are fixed to the end surfaces of the structure (flow path member) at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates (the nozzle plate, the flow path plate, and the diaphragm).

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

A liquid ejection head includes: a first head unit; a second head unit disposed adjacent to the first head unit in a first direction and located on a first side of the first head unit in a second direction; and a heat uniforming unit shared by the first head unit and the second head unit. Each of the first head unit and the second head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. The heat uniforming unit includes a first heat uniforming member disposed on the first side of the first head unit and the second head unit in the second direction. The first heat uniforming member includes a first protrusion located next to the second head unit in the first direction and protruding toward the first head unit.

According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.

A drying device includes a plurality of blowers to blow air onto an object to be dried, the plurality of blowers being disposed along a direction of conveyance of the object to be dried, and a plurality of heaters to heat air inside the plurality of blowers. Each of the plurality of blowers includes an elongated nozzle arranged along a nozzle direction perpendicular to the direction of conveyance of the object to be dried, and an airflow generator to generate airflow to be blown from the elongated nozzle. The plurality of blowers includes a first blower including the airflow generator at a first end of the first blower in the nozzle direction and a second blower including the airflow generator at a second end of the second blower opposite the first end in the nozzle direction.

A liquid jetting apparatus includes: a liquid jetting module having drive elements; a wiring member including: a base material having a first surface; wirings formed on the first surface of the base material; and a protective film configured to covers the first surface of the base material and the wirings; and a heat sink. One of the protective film and the base material, of the wiring member, is formed with an opening through which at least some of the wirings are partially exposed, the wirings of the wiring member are electrically connected to terminals of the drive elements, and the heat sink is joined to the at least some of the wirings via the opening of the wiring member.

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

Provided is an ink jet recording head having a flow path member. The flow path member is made of a thermoset product of a thermosetting molding composition containing a solid epoxy resin composition containing an epoxy resin and a phenolic resin, each solid at ordinary temperatures, and an alumina filler.