B41J2/14088

INKJET PRINT APPARATUS

An inkjet print apparatus includes a print head discharging ink onto a substrate, the print head including a first heater; a reservoir storing the ink; a first pipe supplying the ink to the reservoir; a second pipe collecting surplus ink; a mixing unit located on the first pipe and mixing the ink; a pump located on the second pipe and pressurizing and supplying the surplus ink to the reservoir; a temperature sensor located between the mixing unit and the print head and sensing a temperature of the ink; and a controller controlling a temperature of at least one of the first heater and the second heater in response to information received from the temperature sensor. The print head includes a heat insulator blocking heat emitted from the first heater between the substrate and the first heater.

PRINTABLE AMMONIUM-BASED CHALCOGENOMETALATE FLUIDS

In one example in accordance with the present disclosure, a printable ammonium-based chalcogenometalate fluid is described. The fluid includes an ammonium-based chalcogenometalate precursor. The printable ammonium-based chalcogenometalate fluid also includes an aqueous solvent and water. The printable ammonium-based chalcogenometalate fluid is printed onto a substrate. In the presence of heat, the aqueous solvent, water, and ammonium-based chalcogenometalate precursor break down to form a transition metal dichalcogenide having the form MX.sub.2.

Digital embossing
11014378 · 2021-05-25 · ·

A method of forming a digital embossing on a surface by bonding hard press particles to a carrier. A liquid binder pattern is applied on the carrier by a digital drop application head. Hard press particles are applied on the carrier and the binder pattern such that some hard press particles are bonded to the carrier by the liquid pattern and non-bonded press particles are removed. The carrier with the bonded hard press particles is pressed to the surface and an embossing is formed when the carrier with the hard press particles is removed.

Microfluidic delivery system

Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.

Ink jet recording method and ink jet recording apparatus

An ink jet recording method of the present invention includes: forming an ink image by ejecting an ink onto a transfer body with an ink jet head in which a recording element substrate provided with an element generating energy to be used for ejecting the ink, a pressure chamber including the element inside, and an ejection orifice ejecting the ink is provided, and the ink in the pressure chamber is circulated between the pressure chamber and the outside of the pressure chamber; and transferring the ink image onto a recording medium by bringing the recording medium into contact with the transfer body on which the ink image is formed, wherein a viscosity of the ink is 2 mPa.Math.s or more to 20 mPa.Math.s or less.

LIQUID DISCHARGE APPARATUS
20210122171 · 2021-04-29 ·

A liquid discharge apparatus includes a heater configured to heat a medium, a detector configured to detect a temperature of the heater, a conveyor configured to convey the medium during a printing operation, and circuitry configured to control the heater to heat the medium with a first output during a preheating operation before the printing operation, control the heater to heat the medium with a second output that is equal to or higher than the first output when the temperature of the heater reaches a predetermined threshold value to complete the preheating operation, and control the conveyor to start conveying the medium to start the printing operation.

LIQUID EJECTION HEAD
20210094295 · 2021-04-01 ·

A liquid ejection head includes an ejection orifice forming member having a liquid ejection orifice and a substrate having a liquid flow path such that a liquid circulation flow path is formed between the ejection orifice forming member and the substrate. The liquid circulation flow path includes a bubble generation chamber facing the liquid ejection orifice and is branched from the liquid flow path so as to pass through the bubble generation chamber and join the liquid flow path. The substrate has an ejection energy generation element arranged to face the bubble generation chamber and a circulation energy generation element arranged at a different position to face the liquid circulation flow path. The gap between the ejection energy generation element and the ejection orifice forming member is different from the gap between the circulation energy generation element and the ejection orifice forming member.

DIGITAL THERMAL BINDER AND POWDER PRINTING
20210070065 · 2021-03-11 · ·

A method of forming a digital print on a surface by applying powder of dry ink including colourants on the surface, bonding a part of the dry ink powder to the surface by a digital heating print head such that the digital print is formed by the bonded dry ink colourants and removing non-bonded dry ink from the surface.

PRINT HEAD INTERPOSERS

In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

Liquid discharge head substrate and liquid discharge head

The liquid discharge head substrate includes a first covering portion that covers the first heat generation element and that has conductivity, a second covering portion that covers the second heat generation element and that has conductivity, an insulative layer disposed between the first heat generation element and the first covering portion and between the second heat generation element and the second covering portion, a fuse portion provided on the substrate on a side on which the first covering portion is provided, common wiring for electrically coupling the first covering portion and the second covering portion, the common wiring coupled with the first covering portion via the fuse portion, and a cover layer including at least silicon and carbon and covering the fuse portion.