Patent classifications
B41J2/14088
DIGITAL THERMAL BINDER AND POWDER PRINTING
A method of forming a digital print on a surface by applying powder of dry ink including colourants on the surface, bonding a part of the dry ink powder to the surface by a digital heating print head such that the digital print is formed by the bonded dry ink colourants and removing non-bonded dry ink from the surface.
MEDIUM HEATING DEVICE AND PRINTING APPARATUS
A medium heating device includes a heating unit configured to heat a medium; a first control unit and a second control unit configured to control the heating unit; and a housing including the first control unit and the second control unit inside the housing. Each of the first control unit and the second control unit includes an air inlet and an air outlet. The first control unit and the second control unit include an air intake and exhaust fan installed at at least one of the air inlet and the air outlet of the first control unit, and at at least one of the air inlet and the air outlet of the second control unit. The first control unit and the second control unit are disposed such that the air outlet of the first control unit and the air outlet of the second control unit face each other.
ELEMENT SUBSTRATE, PRINTHEAD AND PRINTING APPARATUS
An element substrate including heaters, drivers for each heater, and a diode, and connected to an external apparatus having a circuit for detecting a temperature based on a detection signal from the diode, comprises: a first wiring grounded, connected to one end of the diode, and serving as a reference voltage of the detection signal; a second wiring connected to the first wiring near the diode; a first pad connected to the first wiring; and a second pad connected to the second wiring. When the substrate is connected to the apparatus, a wiring serving as a reference voltage for a side where the detection signal of the circuit of the apparatus is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the apparatus.
LIQUID EJECTION HEAD, METHOD FOR PRODUCING LIQUID EJECTION HEAD, AND LIQUID EJECTION APPARATUS
A liquid ejection head capable of reducing the thickness of the protective layer as compared to the traditional technique and efficiently transferring the heat energy generated by the heating resistance element to a droplet such as ink and a method of manufacturing the liquid ejection head provide. To achieve this, a power supply wiring are provided in the same layer below the heating resistance element.
Digital thermal binder and powder printing
A method of forming a digital print on a surface (2) by applying powder of dry ink (15) including colourants (7) on the surface, bonding a part of the dry ink (15) powder to the surface (2) by a digital heating print head (80) such that the digital print is formed by the bonded dry ink colourants (7) and removing non-bonded dry ink (15) from the surface (2).
Liquid ejection head substrate and liquid ejection head
A liquid ejection head substrate has heating unit and an element array in which a plurality of ejection energy generating elements generating ejection energy for liquid ejection are arranged on a surface side of a base material. The heating unit includes a heating element extending in a direction of the element array and generating heat by being energized, wiring spaced apart from the heating element in a direction orthogonal to the surface of the base material, and a plurality of connecting portions connecting the heating element and the wiring to each other. The heating element, the wiring, and the plurality of connecting portions are provided in a region overlapping a region where the element array is disposed in a direction orthogonal to the direction of the element array when seen from the direction orthogonal to the surface of the base material. A current flows to the wiring in a middle of a path of the current flowing through the heating element when the heating element is energized.
LIQUID DISCHARGE APPARATUS
A liquid discharge apparatus includes a liquid discharge head configured to discharge a liquid to a medium, a heater configured to heat the liquid in the liquid discharge head, and circuitry configured to cause the heater to heat the liquid in the liquid discharge head, cause the liquid discharge head to discharge the liquid heated by the heater to the medium as a discharge operation, cause the liquid discharge head to discharge the liquid heated by the heater to a portion other than the medium as a dummy discharge operation after the discharge operation, and cause the heater to stop heating the liquid in the liquid discharge head after the dummy discharge operation.
Fluid ejection via different field-effect transistors
In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a number of nozzles to eject an amount of fluid. A first field-effect transistor (FET) activates a first fluidic operation component and a second FET activates a second fluidic operation component. The first FET and the second FET are selected from among a high-side switch FET, a low-side switch FET, and a hybrid FET and the first FET and the second FET are different from one another.
Digital thermal binder and powder printing
A method of forming a digital print on a surface by applying powder of dry ink including colourants on the surface, bonding a part of the dry ink powder to the surface by a digital heating print head such that the digital print is formed by the bonded dry ink colourants and removing non-bonded dry ink from the surface.
DIGITAL EMBOSSING
A method of forming a digital embossing on a surface by bonding hard press particles to a carrier. A liquid binder pattern is applied on the carrier by a digital drop application head. Hard press particles are applied on the carrier and the binder pattern such that some hard press particles are bonded to the carrier by the liquid pattern and non-bonded press particles are removed. The carrier with the bonded hard press particles is pressed to the surface and an embossing is formed when the carrier with the hard press particles is removed.