A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.

A liquid ejection head includes a pressure chamber, an upstream channel, a downstream channel, a pump, an inflow channel, and a bypass channel. The upstream channel communicates with the pressure chamber to supply the liquid to the pressure chamber. The downstream channel communicates with the pressure chamber. The pump communicates with the upstream channel and the downstream channel to cause the liquid in the downstream channel to flow into the upstream channel. The inflow channel communicates with the upstream channel to cause the liquid to be supplied to the pressure chamber to flow into the upstream channel. The upstream channel and the downstream channel communicate with each other through the bypass channel without the pressure chamber being between the upstream channel and the downstream channel. Part of the liquid flowing from the upstream channel into the bypass channel flows into the pressure chamber through the downstream channel.

A liquid election head including a silicon substrate and an element for generating energy that is utilized for electing a liquid on the silicon substrate, wherein a protective layer A containing a metal oxide is disposed on a first surface of the silicon substrate, a structure containing an organic resin and constituting part of a liquid flow passage is disposed on the protective layer A, and an intermediate layer A containing a silicon compound is disposed between the protective layer A and the structure.

There is provide a liquid discharge head including: a supply manifold; a feedback manifold; and a plurality of individual flow channels having: a supply portion, a descender portion, and a feedback portion. The supply manifold has a plurality of supply ports, and the feedback manifold has a plurality of feedback ports. At least part of the supply manifold overlaps with the feedback manifold in the second direction. The plurality of pressure chambers have first pressure chambers forming a first pressure chamber array and second pressure chambers forming a second pressure chamber array. The first pressure chamber array is arranged at one side, of the supply manifold, in a third direction and the second pressure chamber array is arranged at the other side, of the supply manifold, in the third direction. The first pressure chamber array and the second pressure chamber array are connected to the supply manifold.

A print element substrate and a liquid ejection head capable of suppressing degradation of a print quality caused by a white stripe/black stripe etc., is actualized without using a high degree of microfabrication technology. As a result of asymmetric deformation by swelling in a direction of relative movement to a print medium, print elements having different liquid droplet ejection directions are made to coexist and arrayed for that purpose.

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.

A liquid ejecting head includes a liquid discharge unit with a pressure generating chamber group which communicates with a nozzle disposed on a nozzle surface and is formed from pressure generating chambers disposed in a first direction, and a case member which communicates with the pressure generating chamber group and holds a liquid. The case member has a liquid inlet on the side opposite to the liquid discharge direction and at a position between the pressure generating chambers at both ends in the first direction. First and second liquid discharge units are arranged at positions where the first directions of the first and second liquid discharge units are parallel to each other in a second direction that is orthogonal to the first direction, and positions of the liquid inlets of the case member respectively corresponding to the first and second liquid discharge units do not overlap in the second direction.

Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.

An inkjet printhead including: an elongate fluid manifold having a base comprising a plurality of fluid delivery compartments, each compartment having a fluid outlet and a bubble-venting cavity; and one or more printhead chips attached to the base, each printhead chip receiving printing fluid from one or more fluid outlets. Each fluid outlet is aligned with a respective printhead chip and each bubble-venting cavity is offset from the respective printhead chip.