A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

A method for producing a shaped object, the method comprising: laminating a photosensitive resin composition on an inorganic material layer of a substrate having the inorganic material layer on a surface thereof; performing a patterned exposure of the photosensitive resin composition using an i-line; and curing a pattern-exposed portion and removing an unexposed portion to form a shaped object in which a cured product of the photosensitive resin composition is formed on the substrate, wherein the photosensitive resin composition comprises an epoxy resin, at least one cationic polymerization initiator with a molar extinction coefficient in an i-line of less than 500 L.Math.mol.sup.−1.Math.cm.sup.−1 and at least one sensitizer with a molar extinction coefficient in an i-line of 500 L.Math.mol.sup.−1.Math.cm.sup.−1 or more.

A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.

A liquid ejection head includes a substrate having a liquid feeding port and an energy generating element, a substrate protective layer provided on the substrate, and a nozzle forming member provided on the substrate protective layer, and having an ejection port ejecting a liquid, and a liquid flow channel communicating with the liquid feeding port and the ejection port. The substrate protective layer comprises an ion scavenger.

A method for producing a silicon substrate comprising a silicon base material; and a wiring formation layer laminated on a base material surface of the silicon base material, and being provided with a wiring member, an electrode member comprising a noble metal, and a close contact member comprising a base metal between the wiring member and the electrode member, wherein the method comprises a step of forming a deposition film by a fluorocarbon gas, in etching of the silicon substrate; and a removal step of removing, by a removal solution, the deposition film formed by the fluorocarbon gas; the removal solution comprises a primary amine and an organic polar solvent; a content of water in the removal solution is 10 mass % or lower; and a content of tetramethylammonium hydroxide in the removal solution is 1 mass % or lower.

A fluid jet ejection device, a method of making a fluid jet ejection head, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The pharmaceutical drug delivery device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors. At least one of the plurality of fluid ejection nozzles has an orthogonal axial flow path relative to a plane defined by the nozzle plate and at least one of the plurality of fluid ejection nozzles has an angled axial flow path relative to a plane define by the nozzle plate.

A fluid jet ejection device, a method of making a fluid jet ejection head for a fluid ejection device, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The fluid jet ejection device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors, wherein a first portion of the plurality of fluid ejection nozzles have a first axial flow path length and a second portion of the plurality of fluid ejection nozzles have a second axial flow path length greater than the first axial flow path length.

Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

In a substrate, a first flow channel opened in a first surface of a silicon base material having a crystal orientation of <110>, and a second flow channel opened in a second surface of the silicon base material opposite the first surface are formed to communicate with each other. The second flow channel has an opening width narrower than an opening width of the first flow channel, and a groove portion shallower than a depth of the second flow channel is formed close to the opening of the second flow channel in a region that is inside the opening of the first flow channel and outside the opening of the second flow channel in the second surface.