B41J2/1603

Method and apparatus for minimizing via compression in a fluid ejection head
09844937 · 2017-12-19 · ·

A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.

LIQUID DISCHARGE HEAD, MANUFACTURING METHOD THEREFOR, AND RECORDING METHOD

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

METHOD FOR MANUFACTURING STRUCTURE

A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X≧30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

METHOD OF PRODUCING STRUCTURE AND METHOD OF PRODUCING LIQUID DISCHARGE HEAD
20170326880 · 2017-11-16 ·

Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.

PHOTORESIST FORMULATION

A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

LIQUID EJECTION HEAD
20230166507 · 2023-06-01 ·

A liquid ejection head includes a first substrate having a first surface and a second surface opposite the first surface, the first surface having a structure, a second substrate having a second surface facing the first surface of the first substrate, and a third substrate having a first surface facing the second surface of the first substrate. The first, second, and third substrates are joined together by an adhesive. The second surface of the first substrate has an opening located in a region on a rear side of the structure and having corners each having a curvature radius R2. The second surface of the second substrate has an opening in a region facing the structure and having corners each having a curvature radius R1. The curvature radii R1 and R2 satisfy R1<R2.

FLUID EJECTION DEVICE

A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.

INK JET PRINTHEAD

Printheads and methods for forming printheads are described herein. In one example, a printhead includes a single resistor window in a conducting layer within the printhead. The printhead also includes a number of resistors formed in a resistor film deposited over the single resistor window. The resistors have two different widths, and each of the two different widths ejects a different droplet size when energized.

LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE APPARATUS

A liquid discharge head including a first recording element substrate, a second recording element substrate, and a third recording element substrate successively arranged in a longer direction of the liquid discharge head, the first, second, and third recording element substrates each including a discharge port configured to discharge a liquid and an energy-generating element configured to generate energy used for discharging the liquid; a first support member supporting an end part of the first recording element substrate on a side of the second recording element substrate and an end part of the second recording element substrate on a side of the first recording element substrate; and a second support member supporting an end part of the second recording element substrate on a side of the third recording element substrate and an end part of the third recording element substrate on a side of the second recording element substrate.

Chip layout to enable multiple heater chip vertical resolutions

A method of printing, including providing a fluid ejection device that includes a substrate, a plurality of drive units formed on the substrate, each drive unit including at least two drive elements electrically coupled in parallel, and a plurality of fluid ejection elements disposed on the substrate, each fluid ejection element of the plurality of fluid ejection elements electrically coupled with a single respective drive unit. Electrical power is selectively supplied via the plurality of drive units to the plurality of fluid ejection elements to cause fluid to be expelled from the fluid ejection device based on image data.