A head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of suppressing the variation in ejection performance between the ejection channels without changing the shape of a channel (a drive wall) are provided. In the head chip according to an aspect of the present disclosure, when a region in which the first common electrode part and a second common electrode part are opposed in an X direction to each other across the drive wall, and which is configured to generate an electrical field in the drive wall is defined as an opposed region, a dimension in a Z direction in a first upside common part is formed so as to decrease in a direction from the drive wall located at the first side in the X direction toward the drive wall located at the second side in the X direction among the plurality of drive walls, a dimension in the Z direction in a second upside common part is formed so as to decrease in a direction from the drive wall located at the second side in the X direction toward the drive wall located at the first side in the X direction among the plurality of drive walls, and a dimension in a Y direction in the opposed region decreases in directions from the drive walls located at both end sides in the X direction toward the drive wall located in a central portion in the X direction.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring an inter-electrode distance of each of channels while achieving narrowing of a pitch of the channels. In the head chip according to an aspect of the present disclosure, an electrical conducting material removal area in which laser irradiation scars are formed throughout an entire area in an X direction of a portion located between a lower end opening of an ejection channel and a lower end opening of a non-ejection channel is disposed in a portion located between the lower end opening of the ejection channel and the lower end opening of the non-ejection channel in a lower surface of an actuator plate.

In order to provide an inkjet head using an adhesive containing an epoxy resin as a main agent and an imidazole-based curing agent as a curing agent, capable of securing a time for joining work before curing, and having excellent long-term reliability, and a production method for the inkjet head, constituent members are bonded to each other by an adhesive containing at least an epoxy resin as a main agent, a microencapsulated imidazole-based curing agent as a curing agent, and an alcohol that dissolves the microcapsules at a low temperature, and preferably, a residue of the microcapsules dissolved by the alcohol is dispersed in the cured epoxy resin.

According to an embodiment, a liquid ejecting head chip includes an actuator plate and an in-channel electrode. In the actuator plate, a plurality of channels are arranged at a distance in an X-direction. Each of the channels includes an extension portion and a raise-and-cut portion. The extension portion extends in a Z-direction. The raise-and-cut portion continues from the extension portion toward one side of the Z-direction and has a groove depth which is gradually reduced toward the one side of the Z-direction. The in-channel electrode is formed on an inner surface of each of the channels, with a plating film.

A first channel member of a liquid ejection head includes a plurality of plates stacked through an adhesive. A first plate includes a second groove configuring the second common channel, and a plurality of first grooves which are communicated with the second groove from a wall surface of the second groove and individually configure a plurality of third individual channels. A second plate is bonded to a top surface of the first plate and configures an upper surface of the second common channel. The first plate includes an extension part which extends outward from the wall surface of the second groove between an end part position of one end of the second groove and a connection position closest to the end part position among connection positions of the plurality of first grooves with respect to the wall surface of the second groove.

There are provided a head chip, a liquid jet head, and a liquid jet recording device each capable of ensuring an electrical reliability, and enhancing the durability. The head chip according to an aspect of the present disclosure includes an actuator plate having ejection channels and non-ejection channels extending in a Z direction and arranged alternately in an X direction, and a nozzle plate which has nozzle holes respectively communicated with the ejection channels, and faces the actuator plate. The non-ejection channels are terminated at positions separated from a lower end surface of the actuator plate. The ejection channels open on a lower end surface of the actuator plate.

There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an adhesion layer formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the adhesion layer. The nozzle hole includes a recessed part formed on the first surface of the main substrate, and an ink ejecting path formed on a bottom surface of the recessed part and penetrating a bottom wall of the recessed part. The ink ejecting path includes a first ink ejecting path, a second ink ejecting path, and a third ink ejecting path. An inner circumference surface of the third ink ejecting path is approximately perpendicular to the second surface of the main substrate.

According to an embodiment, a liquid ejecting head chip includes an actuator plate, a cover plate, a common electrode, and a connection wiring. In the actuator plate, a plurality of discharge channels and a plurality of non-discharge channels which extend in a Z-direction are alternately arranged at a distance in an X-direction. The cover plate is stacked on an AP-side-Y-direction inner side surface, so as to close the plurality of discharge channels and the plurality of non-discharge channels. The common electrode is formed on an inner surface of each of the discharge channels. The connection wiring is divided so as to be formed in at least 3 or more places in the X-direction on the cover plate, and the common electrode connects the connection wiring to the flexible substrate.

A liquid discharge head includes a base plate, a cavity plate located on the base plate and including a cavity, and a piezoelectric actuator substrate located on the cavity plate. The cavity plate includes: a first groove located inside a contact region with the piezoelectric actuator substrate and configured to release an adhesive for bonding the cavity plate and the piezoelectric actuator substrate; and a second groove located in a manner to surround the contact region with the piezoelectric actuator substrate and configured to release the adhesive. The base plate includes a third groove configured to open the first groove to the atmosphere. The third groove is configured to communicate between the first groove and the outside through a first hole communicating with the first groove and a second hole located outside the contact region of the cavity plate and the piezoelectric actuator substrate.

A head chip prevented from deteriorating in printing quality is provided. The head chip is provided with an intermediate plate which has a plurality of columns of communication hole groups for each channel column, the communication hole group having communication holes individually communicated with ejection channels of an actuator plate and arranged in a line in an X direction. The communication holes adjacent to each other in the X direction are arranged so as to be shifted in a Y direction from each other. The intermediate plate is provided with a non-penetrating groove closed by a nozzle plate, and a penetrating hole communicated with the non-penetrating groove, and communicated with an outside of the head chip through a non-ejection channel. A part of the non-penetrating groove is located in an inter-communication hole region. A minimum gap in the X direction between an opening edge of the communication hole and the non-penetrating groove in the inter-communication hole region is larger than a minimum gap in the X direction between the opening edge of the communication hole and the non-ejection channel.