A MEMS device includes a first substrate in which a first electrode layer, a dielectric layer, and a second electrode layer are stacked on a driving region in this order; and a second substrate which is disposed to face a surface on which the dielectric layer of the first substrate is stacked. The first electrode layer and the dielectric layer extend beyond the second electrode layer toward a non-driving region separated from the driving region, a first resin having elasticity is disposed in a region including an end of the second electrode layer in an extending direction of the dielectric layer, and the first substrate and the second substrate are fixed with an adhesive in a state where the elastically deformed first resin is sandwiched therebetween.

A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.

Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).

A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.

An inkjet head comprises a drive section, a nozzle plate, a substrate and a wiring section. The drive section comprises two integral piezoelectric members of which polarization directions are opposite with respect to the longitudinal direction of the piezoelectric member, wherein a plurality of grooves arranged from one piezoelectric member to the middle of the other piezoelectric member and a plurality of holes arranged across the two piezoelectric members are alternately arranged along the longitudinal direction of the piezoelectric member. The nozzle plate is fixed on one main surface of the one piezoelectric member and comprises a plurality of nozzle holes facing the plurality of the grooves. The substrate is fixed with the other main surface of the other piezoelectric member. The wiring section is arranged on an inner surface of the hole and at a position facing the hole of the substrate.

A method for manufacturing a liquid ejection head including the steps of preparing a substrate including, on a surface of the substrate, a layer having a plurality of openings in which opening portions of supply portions are located and which are arrayed in an array direction and another opening which is different from the plurality of openings and is located beyond the array end portion in the array direction, and attaching a dry film for forming flow passages to the substrate and the layer.

A piezoelectric actuator includes: a plurality of discrete electrodes, which is disposed on one side of a piezoelectric element; a common electrode, which is disposed on the other side of the piezoelectric element; a plurality of discrete contacts, which are respectively connected to the plurality of discrete electrodes, and wherein the plurality of discrete electrodes include: a first discrete electrode; and a second discrete electrode, which is disposed at a position away from a corresponding discrete contact as compared with the first discrete electrode, wherein the common electrode includes: a first common electrode, which faces the first discrete electrode in the thickness direction; and a second common electrode, which is separated from the first common electrode in the surface direction and faces the second discrete electrode in the thickness direction, and wherein a connection wiring is provided to connect the first common electrode with the second common electrode.

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.

An ejection material ejecting device includes: an ejection unit including an ejection opening configured to eject an ejection material; an electric substrate configured to control ejection of the ejection material; a first flexible cable connected to the ejection unit; a second flexible cable connected to the electric substrate; and a joint at which the first flexible cable and the second flexible cable are joined by an anisotropic conductive film, wherein the joint is covered with a sealant resistant to the ejection material.