A head chip prevented from deteriorating in printing quality is provided. The head chip is provided with an intermediate plate which has a plurality of columns of communication hole groups for each channel column, the communication hole group having communication holes individually communicated with ejection channels of an actuator plate and arranged in a line in an X direction. The communication holes adjacent to each other in the X direction are arranged so as to be shifted in a Y direction from each other. The intermediate plate is provided with a non-penetrating groove closed by a nozzle plate, and a penetrating hole communicated with the non-penetrating groove, and communicated with an outside of the head chip through a non-ejection channel. A part of the non-penetrating groove is located in an inter-communication hole region. A minimum gap in the X direction between an opening edge of the communication hole and the non-penetrating groove in the inter-communication hole region is larger than a minimum gap in the X direction between the opening edge of the communication hole and the non-ejection channel.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of homogenously forming protective films on inner surfaces of channels while dealing with miniaturization of the channels and a decrease in pitch of the channels. The head chip according to an aspect of the present disclosure includes an actuator plate having a plurality of ejection channels arranged, a common electrode formed on an inner surface of the ejection channel, a first protective film disposed so as to cover the common electrode on the inner surface of the ejection channel, an intermediate plate which has ejecting communication holes and ejection-side introduction ports respectively communicated with the plurality of ejection channels, and which is disposed so as to face a channel opening surface on which the ejection channels open in the actuator plate, and a nozzle plate which has a plurality of nozzle holes configured to eject ink, and which is disposed at an opposite side to the actuator plate with respect to the intermediate plate in a state in which the ejecting communication holes are respectively communicated with the nozzle holes, and the ejection-side introduction ports are closed.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

According to one embodiment, a liquid ejection head includes an actuator with a plurality of pressure chambers and dummy chambers. The pressure chambers are each part of a groove that is disposed between an adjacent pair of sidewalls. Each pressure chamber is in fluid communication with a nozzle for ejecting a liquid. The dummy chambers are each between an adjacent pair of pressure chambers. A common chamber is fluidly connected to an end of each of the pressure chambers. A throttle portion is at the end portion of each pressure chamber. Each throttle portion blocks a part of a liquid flow path from the first common chamber to the pressure chamber. The first throttle portion is formed of a resin material.

A substrate having a recessed portion, a diaphragm, and a piezoelectric actuator are provided, the diaphragm includes a first layer containing silicon as a constituent element, and a third layer disposed between the first layer and the piezoelectric actuator and containing zirconium as a constituent element, and a laminated side surface of the first layer and the third layer is covered with a moisture-resistant protective film containing at least one selected from the group made of oxide, nitride, metal, and diamond-like carbon.

A liquid discharge head includes a nozzle plate, an individual liquid chamber, and an actuator. The nozzle plate has a nozzle on a liquid discharge face and a through hole communicating with the nozzle and penetrating the nozzle plate. The nozzle plate includes a substrate including a first silicon layer on a side of the liquid discharge face, a second silicon layer, a first silicon oxide film layer, and a second silicon oxide layer on a surface of the second silicon layer different from a surface of the second silicon layer in contact with the first silicon oxide film layer. A thickness of the first silicon layer is smaller than a thickness of the second silicon layer. A portion of the through hole penetrating the first silicon layer has a smaller diameter than a portion of the through hole penetrating the second silicon layer.

Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

A liquid ejecting head includes a pressure chamber substrate in which wall surface portions of a pressure chamber are formed, an diaphragm that forms a top surface portion of the pressure chamber, a piezoelectric element that is provided on the diaphragm, and a communication plate, in which an upper surface of the communication plate is bonded to a lower surface of the pressure chamber substrate by an adhesive, the upper surface of the communication plate is provided with a supply opening and a discharge opening, the pressure chamber is longitudinal in an X direction, acute angle portions are formed by the wall surface portions that mutually form an acute angle at each end in the X direction of a bottom surface portion of the pressure chamber, and the acute angle portions do not overlap with the supply opening and the discharge opening in a laminating direction.

Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

Process for manufacturing a microfluidic device, wherein a sacrificial layer is formed on a semiconductor substrate; a carrying layer is formed on the sacrificial layer; the carrying layer is selectively removed to form at least one release opening extending through the carrying layer; a permeable layer of a permeable semiconductor material is formed in the at least one release opening; the sacrificial layer is selectively removed through the permeable layer to form a fluidic chamber; the at least one release opening is filled with non-permeable semiconductor filling material, forming a monolithic body having a membrane region; an actuator element is formed on the membrane region and a cap element is attached to the monolithic body and surrounds the actuator element.