A method for manufacturing a microstructure comprising cured products of photosensitive resin compositions, the method comprising: a step of forming at least two layers of the photosensitive resin compositions each comprising a photopolymerization initiator; a step of subjecting each of the formed at least two layers of the photosensitive resin compositions to patterning exposure; and a step of collectively developing the exposed at least two layers of the photosensitive resin compositions to obtain a microstructure, wherein in the at least two layers of the photosensitive resin compositions, 90% by mass or more of the photopolymerization initiators contained in at least one of the two adjacent layers of the photosensitive resin compositions is a nonionic photopolymerization initiator.

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

A flow passage forming member includes flow passage forming member main bodies 140 and 146 that are formed of a resin material and define at least a part of a flow passage, a metal protective film 200 that is provided on a surface of the flow passage forming member main body 140 and a surface of the flow passage forming member main body 146 defining at least the flow passage and is formed of a metal material, and a protective film 210 that is laminated on the metal protective film 200 and contains an oxide or a nitride of at least on element selected from the group consisting of tantalum (Ta), titanium (Ti), zirconium (Zr), niobium (bib), vanadium (V), hafnium (Hf), silicon (Si), aluminum (Al), tungsten (W), and yttrium (Y).

A manufacturing method of a liquid ejection head including manufacturing a flow path constituting member for supplying a liquid to an ejection module, the manufacturing a flow path constituting member including using a metal mold which is constituted of a fixed mold and a movable mold, the manufacturing a flow path constituting member including: a first step of molding a first member, a second member, and a third member independently at locations different from each other in the metal mold, the first member, the second member, and the third member constituting the flow path constituting member; a second step of joining the first member and the second member in a specific manner; and a third step of joining the second member and the third member in a specific manner.

A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.

A head chip, a liquid jet head, and a liquid jet recording device each capable of increasing pressure generated while achieving power saving are provided. The head chip according to an aspect of the present disclosure includes a flow channel member, an actuator plate, and drive electrodes. The drive electrodes include a first electrode disposed on a first surface of the actuator plate so as to overlap one of a pressure chamber and a partition wall when viewed from a first direction, a second electrode which is disposed on the first surface of the actuator plate so as to be adjacent to the first electrode, and which generates a potential difference from the first electrode, and a first opposed electrode which is individually disposed on a second surface of the actuator plate at a position opposed to the first electrode, and which generates a potential difference from the first electrode.

Provided are a barium titanate-based piezoelectric ceramics having satisfactory piezoelectric performance and a satisfactory mechanical quality factor (Q.sub.m), and a piezoelectric element using the same. Specifically provided are a piezoelectric ceramics, including: crystal particles; and a grain boundary between the crystal particles, in which the crystal particles each include barium titanate having a perovskite-type structure and manganese at 0.04% by mass or more and 0.20% by mass or less in terms of a metal with respect to the barium titanate, and the grain boundary includes at least one compound selected from the group consisting of Ba.sub.4Ti.sub.12O.sub.27 and Ba.sub.6Ti.sub.17O.sub.40, and a piezoelectric element using the same.

A piezoelectric actuator array includes a substrate plate with a number of signal leads and at least one common lead, and a number of piezoelectric bodies arranged in a row on one surface of the substrate plate and formed by dividing a common piezoelectric block. The piezoelectric bodies include a number of active bodies each of which has, on a first side of the row, a signal electrode in contact with one of the signal leads and, on an opposite second side of the row, a common electrode in contact with the common lead. The substrate plate has at least one connector lead disposed on the first side of the row and electrically connected to the common lead on the second side of the row. At least one piezoelectric body has a conductive outer surface layer that establishes an electrically conductive path from the connector lead to the common lead.

There is provided a method for producing a liquid transport apparatus includes: a pressure chamber plate partially defining a pressure chamber that communicates with a nozzle for ejecting liquid; an insulating ceramics layer located on a surface of the pressure chamber plate to cover the pressure chamber; a piezoelectric layer located on the insulating ceramics layer; and a first electrode located on the piezoelectric layer. The method includes: forming the insulating ceramics layer on the pressure chamber plate by heating an insulating ceramic material; forming the piezoelectric layer and the first electrode on the insulating ceramics layer; forming the piezoelectric layer including annealing the piezoelectric layer at the annealing temperature; and forming the pressure chamber by removing a part of the pressure chamber plate so that a part of the insulating ceramics layer is exposed on the pressure chamber.

A piezoelectric device includes a first substrate that includes a piezoelectric element (32) provided in a first region where bending deformation is allowed and an electrode layer (39) electrically connected to the piezoelectric element (32), a second substrate in which a bump electrode (43) abutting and conducting the electrode layer (39), and having elasticity is formed, and which is disposed so as to face the piezoelectric element (32) with a predetermined space, and adhesive (43) that bonds the first substrate and the second substrate in a state where a distance between the first substrate and the second substrate is maintained. The adhesive (43) has a width in a center portion in a height direction relative to a surface of the first substrate or the second substrate greater than a width in end portions in the same direction.