Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A nozzle plate includes a base having a through-hole to be a nozzle, and a metal film covering at least an inner wall of the through-hole of the base. The base contains nickel as a main component. The metal film contains nickel and palladium as main components. In a cross section including the base and the metal film, the metal film has a palladium content variation smaller than or equal to 4 at % on an imaginary line (A) along an interface between the base and the metal film.

A liquid ejection head includes an ejection hole surface where a plurality of nozzles ejecting liquid open. The ejection hole surface includes a nozzle arrangement region where the plurality of nozzles are arranged. Each nozzle includes an inversely tapered part where a cross-sectional area increases toward the ejection hole surface. A first nozzle is arranged at a center part of a predetermined direction of the nozzle arrangement region, while second nozzles are arranged at the end parts at the two sides in the predetermined direction. When viewed from the ejection hole surface side as T, the width of the first nozzle's inversely tapered part is larger than the widths of the inversely tapered parts of the second nozzles. In the nozzle arrangement region, the ejection hole surface includes a shape that the center part in the predetermined direction projects with respect to the end parts on the two sides.

A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure-chamber-forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

A nozzle head includes a plate portion arranged in a plate shape, a droplet discharging nozzle portion located in the plate portion, the droplet discharging nozzle portion including a plurality of droplet discharging nozzles ejecting droplets by an electrostatic discharging method, and a pseudo-nozzle portion located around the droplet discharging nozzle portion in the plate portion and including a plurality of pseudo-nozzles. In the nozzle head described above, the plurality of droplet discharging nozzles may be arranged in line in a first direction, and the pseudo-nozzle portion may be arranged on both sides of the droplet discharging nozzle portion.

A nozzle member includes a base, a metal oxide film, and a water-repellent film. The base includes a first surface having a plurality of through-holes as ejection orifices. The metal oxide film is located on the first surface. The water-repellent film is located on the metal oxide film. The metal oxide film has a greater thickness in a first area than in a second area. The first area is an area surrounding each ejection orifice. The second area is an area between adjacent first areas.

A liquid ejection head includes an ejection hole surface where a plurality of nozzles ejecting liquid open. The ejection hole surface includes a nozzle arrangement region where the plurality of nozzles are arranged. Each nozzle includes an inversely tapered part where a cross-sectional area increases toward the ejection hole surface. A first nozzle is arranged at a center part of a predetermined direction of the nozzle arrangement region, while second nozzles are arranged at the end parts at the two sides in the predetermined direction. When viewed from the ejection hole surface side as T, the width of the first nozzle's inversely tapered part is larger than the widths of the inversely tapered parts of the second nozzles. In the nozzle arrangement region, the ejection hole surface includes a shape that the center part in the predetermined direction projects with respect to the end parts on the two sides.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A nozzle plate includes a base having a through-hole to be a nozzle, and a metal film covering at least an inner wall of the through-hole of the base. The base contains nickel as a main component. The metal film contains nickel and palladium as main components. In a cross section including the base and the metal film, the metal film has a palladium content variation smaller than or equal to 4 at % on an imaginary line (A) along an interface between the base and the metal film.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.