A liquid ejection head includes an ejection orifice for ejecting a liquid; a substrate on which an energy-generating element and an insulating layer are formed on a first surface; a liquid inflow path which penetrates the substrate and makes a liquid flow in a flow path disposed between the ejection orifice and the element; and a liquid outflow path which penetrates the substrate and makes the liquid flow out of the flow path. The liquid inflow path and the liquid outflow path have a first opening and a second opening penetrating the insulating layer on the first surface of the substrate, the ejection orifice is disposed between the liquid inflow path and the liquid outflow path, and an ejection orifice side end of the second opening is formed closer to the ejection orifice than an ejection orifice side end of the first opening.

One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.

A piezoelectric device includes: a first electrode provided above a substrate; a piezoelectric layer provided above the first electrode; and a second electrode provided above the piezoelectric layer. The piezoelectric layer includes a plurality of layers that includes a composite oxide of a Perovskite structure containing potassium, sodium, and niobium. The piezoelectric layer has a first region and a second region in a 3 μm×3 μm region of a plane perpendicular to a thickness direction of the piezoelectric layer. The first region is a region in which the ratio of an atomic concentration (atm %) of potassium with respect to the sum of the atomic concentration (atm %) of potassium and an atomic concentration (atm %) of sodium is 0.30 to 0.45, and the second region is a region in which the ratio is 0.55 to 0.75.

The microfluidic device has a plurality of ejector elements. Each ejector element includes a first region, accommodating a first fluid flow channel and an actuator chamber; a second region, accommodating a fluid containment chamber; and a third region, accommodating a second fluid flow channel. The fluid containment chamber is fluidically coupled to the first and to the second fluid flow channels. The second region is formed from a membrane layer, from a membrane definition layer, mechanically coupled to the membrane layer and having a membrane definition opening, and a fluid chamber defining body, mechanically coupled to the membrane definition layer and having a chamber defining opening, with a width greater than the width of the membrane definition opening. The width of the membrane is thus defined by the width of the chamber defining opening.

In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A heterogeneous integration chip of a micro fluid actuator is disclosed and includes a first substrate, a first insulation layer, a first conductive layer, a piezoelectric layer, a second conductive layer, a second substrate, a control element, a perforated trench and a conductor. The first substrate includes a first chamber. The first insulation layer is disposed on the first substrate. The first conductive layer is disposed on the first insulation layer and includes an electrode pad. The piezoelectric layer and the second conductive layer are stacked on the first conductive layer sequentially. The second substrate is assembled to the first substrate through a bonding layer to define a second chamber and includes an orifice, a fluid flowing channel and a third chamber. The control element is disposed in the second substrate. The perforated trench filled with the conductor is penetrated from the electrode pad to the second substrate.

A liquid discharge head includes a recording element substrate including a discharge port configured to discharge a liquid, a pressure generating element configured to pressurize the liquid to discharge the liquid, and an electric connecting portion connected to the pressure generating element through an electric wiring and configured to supply power for driving the pressure generating element to the pressure generating element. The liquid discharge head includes a first recessed portion and a second recessed portion formed in a range from a back surface of a discharge port surface in which the discharge port of the recording element substrate is formed up to the electric connecting portion, and a communicating portion configured to connect a space formed within the first recessed portion and a space formed within the second recessed portion by allowing the first recessed portion and the second recessed portion to communicate with each other.

A substrate for use in a liquid ejection head has an ejection hole for ejecting a liquid from the inside to the outside of the substrate. A plurality of scallops periodically changing the diameter of an inner circumferential surface of the ejection hole in the penetration direction are formed on the inner circumferential surface. The substrate for a liquid ejection head is characterized in that a width in the penetration direction of a first scallop present on the outermost side among the plurality of scallops is narrower than a width in the penetration direction of a second scallop adjacent to the first scallop on the inward side, and a depth in a radial direction of the ejection hole of the first scallop is shallower than a depth in the radial direction of the ejection hole of the second scallop.

There are provided an inkjet head, an inkjet image forming apparatus, a nozzle plate manufacturing method, and an inkjet head manufacturing method capable of improving durability against wiping on an ink discharge surface. The inkjet head includes a nozzle substrate including nozzle holes from which ink is discharged. The nozzle substrate has an irregularity structure formed on an ink discharge surface such that neither ink particles contained in the ink nor a wiping member that wipes the ink discharge surface get caught by the irregularity structure.