Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

A liquid ejecting head includes a pressure chamber substrate in which wall surface portions of a pressure chamber are formed, an diaphragm that forms a top surface portion of the pressure chamber, a piezoelectric element that is provided on the diaphragm, and a communication plate, in which an upper surface of the communication plate is bonded to a lower surface of the pressure chamber substrate by an adhesive, the upper surface of the communication plate is provided with a supply opening and a discharge opening, the pressure chamber is longitudinal in an X direction, acute angle portions are formed by the wall surface portions that mutually form an acute angle at each end in the X direction of a bottom surface portion of the pressure chamber, and the acute angle portions do not overlap with the supply opening and the discharge opening in a laminating direction.

In a substrate, a first flow channel opened in a first surface of a silicon base material having a crystal orientation of <110>, and a second flow channel opened in a second surface of the silicon base material opposite the first surface are formed to communicate with each other. The second flow channel has an opening width narrower than an opening width of the first flow channel, and a groove portion shallower than a depth of the second flow channel is formed close to the opening of the second flow channel in a region that is inside the opening of the first flow channel and outside the opening of the second flow channel in the second surface.

A liquid discharge head includes a nozzle member. The nozzle member includes a nozzle, a deformable laminar member, and an electromechanical transducer. The nozzle discharges liquid. The deformable laminar member has an opening forming the nozzle. The electromechanical transducer is disposed around the opening. The nozzle member is warped with respect to a discharge-side plane of the nozzle member in a surrounding area of the nozzle when no voltage is applied to the electromechanical transducer.

A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.

An actuator includes: a frame having a recess; an actuator substrate including a common chamber; a damper between the frame and the actuator substrate, the damper defining a part of a wall of the common chamber of the actuator substrate. The damper includes multiple layers laminated in a lamination direction, and the multiple layers is symmetrical in the lamination direction with respect to a center of the damper in the lamination direction.

A fluid jet ejection device, a method of making a fluid jet ejection head, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The pharmaceutical drug delivery device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors. At least one of the plurality of fluid ejection nozzles has an orthogonal axial flow path relative to a plane defined by the nozzle plate and at least one of the plurality of fluid ejection nozzles has an angled axial flow path relative to a plane define by the nozzle plate.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate.

Provided is a fabrication method of print head of MCM device formed micro patterned air gap capable of picoliter-scale droplet printing, and more particularly, is characterized in that comprising preparing silicon wafer 10 washed by piranha solution at step A, stacking silicon nitride films 20 and 20′ up front surface and back surface of prepared silicon wafer at step B, drying after applying photoresists 30 and 30′ to top surface and bottom surface of the silicon nitride film 20 and 20′ at step C, removing partially the photoresists through pre-determined pattern by irradiation of ultraviolet after arranging photomask 40 formed through pre-determined pattern in any one side of the photoresists 30 and 30′ at step D, forming sample droplet storage space opening by removing silicon nitride film 21 contacted to photoresists removed by pre-determined pattern at step E, removing the photoresists 30 and 30′ stacked up the silicon nitride film 20 and 20′ at step F, forming sample droplet storage space 50 by etching the silicon wafer at step G, and forming sample droplet opening 60 by irradiating ultrasonic waves at step H.

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.