A channel member includes a first substrate in which a channel is formed from a first surface, and a second substrate having a second surface facing the first surface, wherein the first substrate and the second substrate are bonded to each other with an adhesive between the first surface and the second surface, wherein the channel has a polygonal shape when viewed from a direction orthogonal to the first surface, wherein the channel includes a first portion on the first surface side and a second portion that communicates with the first portion, wherein an aperture area of the second portion is larger than an aperture area of the first portion when viewed from the direction orthogonal to the first surface, and wherein the adhesive is present on a step surface between the first portion and the second portion and at vertices of the polygonal shape.

A flow path member includes a first substrate, a second substrate, bonding adhesive, and recessed portions. The first substrate has a first surface formed with an opening of a flow path. The second substrate has a second surface facing the first surface. The bonding adhesive bonds the first and second surfaces together. The recessed portions are formed in at least one of the first surface of the first substrate and the second surface of the second substrate. Each recessed portion is a hole configured to take up excess bonding adhesive and, as a non-through hole, does not extend through the entire thickness of a substrate. Each of the recessed portions extends into the first substrate or the second substrate as a rectangular column or an elliptical column and, when a shape of each recessed portion is viewed from the direction orthogonal to the first surface, the shape is approximately isotropic.

An ejection head. The ejection head includes first fluid ejectors and second fluid ejectors deposited on a semiconductor substrate. A first flow feature layer is attached to the semiconductor substrate to provide a first fluid supply channels and a first fluid chambers and a first portion of second fluid channel and second fluid chambers therein. A second flow feature layer is attached to the first flow feature layer to provide a first portion of first nozzle holes and a second portion of second fluid supply channels and second fluid chambers therein. A first nozzle plate layer is attached to the second flow feature layer to provide a second portion of the first nozzle holes and a first portion of second nozzle holes therein. A second nozzle plate layer is attached to the first nozzle plate layer to provide a second portion of the second nozzle holes therein.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

A method for producing a shaped object, the method comprising: laminating a photosensitive resin composition on an inorganic material layer of a substrate having the inorganic material layer on a surface thereof; performing a patterned exposure of the photosensitive resin composition using an i-line; and curing a pattern-exposed portion and removing an unexposed portion to form a shaped object in which a cured product of the photosensitive resin composition is formed on the substrate, wherein the photosensitive resin composition comprises an epoxy resin, at least one cationic polymerization initiator with a molar extinction coefficient in an i-line of less than 500 L.Math.mol.sup.−1.Math.cm.sup.−1 and at least one sensitizer with a molar extinction coefficient in an i-line of 500 L.Math.mol.sup.−1.Math.cm.sup.−1 or more.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

A liquid ejection head includes a substrate having a liquid feeding port and an energy generating element, a substrate protective layer provided on the substrate, and a nozzle forming member provided on the substrate protective layer, and having an ejection port ejecting a liquid, and a liquid flow channel communicating with the liquid feeding port and the ejection port. The substrate protective layer comprises an ion scavenger.

According to one embodiment, a liquid ejection head includes an actuator with a plurality of pressure chambers and dummy chambers. The pressure chambers are each part of a groove that is disposed between an adjacent pair of sidewalls. Each pressure chamber is in fluid communication with a nozzle for ejecting a liquid. The dummy chambers are each between an adjacent pair of pressure chambers. A common chamber is fluidly connected to an end of each of the pressure chambers. A throttle portion is at the end portion of each pressure chamber. Each throttle portion blocks a part of a liquid flow path from the first common chamber to the pressure chamber. The first throttle portion is formed of a resin material.

A substrate having a recessed portion, a diaphragm, and a piezoelectric actuator are provided, the diaphragm includes a first layer containing silicon as a constituent element, and a third layer disposed between the first layer and the piezoelectric actuator and containing zirconium as a constituent element, and a laminated side surface of the first layer and the third layer is covered with a moisture-resistant protective film containing at least one selected from the group made of oxide, nitride, metal, and diamond-like carbon.