A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones. A nozzle plate in formed on the channel layer by forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

Atomic-to-Nanoscale Matter Emission/Flow Regulation Devices, Systems and methods are set forth. An exemplary device can include a through-hole that has a top, and a nozzle configured to facilitate atomic-to-nanoscale matter emission/flow regulation formed in an etchable nozzle substrate. The nozzle can be configured at the smallest cross-section of the through-hole. A bottom can be formed in the nozzle substrate or selectively connected to the nozzle. Systems can include matter transportation/flow regulation columns, printing systems, etching systems and the like through which self-aligned nanodroplets or single-to-finite numbered ionic species/gas phase matter can flow under spontaneous or external excitation conditions (such as voltages) at atmospheric as well as regulated pressures.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

A liquid discharge head configured to discharge a liquid, the liquid discharge head includes a thin film member including a first layer, a second layer bonded with the first layer, and a through hole penetrating through the first layer and the second layer. The through hole includes the first opening in the first layer and the second opening in the second layer.

A head chip prevented from deteriorating in printing quality is provided. The head chip is provided with an intermediate plate which has a plurality of columns of communication hole groups for each channel column, the communication hole group having communication holes individually communicated with ejection channels of an actuator plate and arranged in a line in an X direction. The communication holes adjacent to each other in the X direction are arranged so as to be shifted in a Y direction from each other. The intermediate plate is provided with a non-penetrating groove closed by a nozzle plate, and a penetrating hole communicated with the non-penetrating groove, and communicated with an outside of the head chip through a non-ejection channel. A part of the non-penetrating groove is located in an inter-communication hole region. A minimum gap in the X direction between an opening edge of the communication hole and the non-penetrating groove in the inter-communication hole region is larger than a minimum gap in the X direction between the opening edge of the communication hole and the non-ejection channel.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of homogenously forming protective films on inner surfaces of channels while dealing with miniaturization of the channels and a decrease in pitch of the channels. The head chip according to an aspect of the present disclosure includes an actuator plate having a plurality of ejection channels arranged, a common electrode formed on an inner surface of the ejection channel, a first protective film disposed so as to cover the common electrode on the inner surface of the ejection channel, an intermediate plate which has ejecting communication holes and ejection-side introduction ports respectively communicated with the plurality of ejection channels, and which is disposed so as to face a channel opening surface on which the ejection channels open in the actuator plate, and a nozzle plate which has a plurality of nozzle holes configured to eject ink, and which is disposed at an opposite side to the actuator plate with respect to the intermediate plate in a state in which the ejecting communication holes are respectively communicated with the nozzle holes, and the ejection-side introduction ports are closed.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.