A manufacturing method of narrow type inkjet print head chip is provided and includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.

A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.

A head chip, liquid jet head, and liquid jet recording device are described. An actuator plate is adapted to apply pressure to the liquid, and includes a first surface, and a second surface facing to an opposite side to the first surface, ejection channels and non-ejection channels which have an opening on the first and/or second surface and are alternately arranged to be separated from each other, a common electrode disposed on a sidewall of the ejection channel, an individual electrode electrically separated from the common electrode and disposed on a sidewall of the non-ejection channel, a common electrode pad disposed on the first surface and adapted to electrically connect the common electrode and a wiring board to each other, and a bypass interconnection adapted to electrically connect the individual electrodes in the non-ejection channels adjacent to each other and failing to be exposed on the first surface.

A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.

A liquid ejection head includes a substrate, an ejection orifice forming member having a plurality of ejection orifices for ejecting a liquid, and an intermediate layer provided between the substrate and the ejection orifice forming member. The substrate has a supply path for supplying the liquid to the plurality of ejection orifices, the ejection orifice forming member has a common liquid chamber communicating with the plurality of ejection orifices, the supply path and the common liquid chamber communicate with each other via a filter portion including a plurality of holes formed in the intermediate layer, the ejection orifice forming member has a wall portion that protrudes into the common liquid chamber at a position opposed to the filter portion, and the wall portion extends along a direction intersecting an arrangement direction of the plurality of ejection orifices.

Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.

A head chip capable of suppressing the degradation of the reliability, and a liquid jet head and a liquid jet recording device using the head chip are provided. The head chip includes an actuator plate having a plurality of ejection channels respectively communicated with nozzle holes and electrodes disposed on inner walls of the respective ejection channels, a bonded plate to be bonded to the actuator plate, and having a liquid contact surface which liquid entered the ejection channels has contact with, an adhesive layer disposed between the bonded plate and the actuator plate, and adapted to bond the bonded plate and the actuator plate to each other, and a protective film adapted to cover continuously from inner walls of the respective ejection channels to at least a part of the liquid contact surface via an end surface of the adhesive layer exposed on the ejection channel side.

Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example non-transitory computer readable medium includes instructions that, when executed, cause at least one processor to at least control movement of a laser to cause the laser to etch an electrode pattern in a first substrate, the electrode pattern including a first set of electrodes, a second set of electrodes, and a third set of electrodes; control a printer driver to cause a hydrophobic material and a dielectric material to be applied to the second set of electrodes and not the first set of electrodes via a printer; control a bonding driver to cause a gap to be defined between the first substrate and a second substrate; and control a dicing driver to cause a portion the first substrate and a portion of the second substrate to be cut into a droplet actuator.

Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example method disclosed herein for making a droplet actuator includes ablating a first substrate with a laser to form an electrode array on the first substrate. The example method includes applying at least one of hydrophobic or a dielectric material to the electrode array. The example method also includes aligning the first substrate with a second substrate. The second substrate includes a second treated layer. In the example method, the alignment includes a gap between at least a portion of the first treated layer and at least a portion the second treated layer.

A piezoelectric element has a diaphragm, a first electrode on the diaphragm, a piezoelectric layer on the first electrode, and a second electrode on the piezoelectric layer. The piezoelectric layer is a stack of multiple piezoelectric films and is made of a perovskite composite oxide containing lead, zirconium, and titanium and represented by the general formula ABO.sub.3, with the molar ratio of the A-site to the B-site (A/B) in the perovskite composite oxide being 1.14 or more and 1.22 or less. In current-time curve measurement, the activation energy calculated from relaxation current using an Arrhenius plot is 0.6 [eV] or less. The relaxation current is the amount of current at the time at which a downward trend in current turns upward.