Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

An example molded fluidic die assembly includes a fluidic die including an electrical component and a fluidic architecture on a first face of the fluidic die, the fluidic architecture including a front face; circuitry; an electrical connection coupling the circuitry to the electrical component on the first face of the fluidic die; and a continuous molded compound that surrounds the fluidic die and encompasses the electrical connection.

A filter is compressed between facing surfaces of a first configuration component and a second configuration component, and a molten resin is poured in such a compressed state. Injection molding of the first configuration component and the second configuration component, joining of the configuration components, and sealing of the circumference of the filter are performed by a pair of metal molds.

A manufacturing method of a liquid ejection head including manufacturing a flow path constituting member for supplying a liquid to an ejection module, the manufacturing a flow path constituting member including using a metal mold which is constituted of a fixed mold and a movable mold, the manufacturing a flow path constituting member including: a first step of molding a first member, a second member, and a third member independently at locations different from each other in the metal mold, the first member, the second member, and the third member constituting the flow path constituting member; a second step of joining the first member and the second member in a specific manner; and a third step of joining the second member and the third member in a specific manner.

A cover member includes two end regions located at two ends in a first direction, and two beam portions which extend in the first direction and connect the two end regions together and which, together with the two end regions, form a single opening that exposes a plurality of discharge ports. When a width of the opening is denoted as a [mm], a minimum length in the first direction of the end regions is denoted as c [mm], a modulus of longitudinal elasticity of the cover member is denoted as E [GPa], and a thickness of the cover member is denoted as t [mm], the following expression is established.

[00001]$c\ge \frac{10.Math.{\left(\frac{a}{25}\right)}^4}{{\left(\frac{t}{0.3}\right)}^3.Math.\left(\frac{E}{200}\right)}$

A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.

In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.