A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten μm to two hundred μm, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.

A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.