Patent classifications
B41J2/164
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD
A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.
Leak mitigation devices
A leak mitigation device includes a planar portion and a tail portion. The planar portion has a first width. The tail portion has a proximal end and a distal end. The proximal end is attached to the planar portion and has a second width less than the first width. The planar portion and the tail portion comprise an absorbent material.
FLUIDIC DEVICE WITH NOZZLE LAYER CONDUCTORS
One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.
Adhering layers of fluidic dies
In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.
ACTUATOR, LIQUID DISCHARGE HEAD, LIQUID DISCHARGE APPARATUS, AND METHOD FOR MANUFACTURING ACTUATOR
An actuator includes: a diaphragm on a substrate having a pressure chamber, the diaphragm having a first surface defining a part of a wall of the pressure chamber; a piezoelectric element on a second surface of the diaphragm opposite to the first surface; a lead wire led out from the piezoelectric element to supply electric power to the piezoelectric element; and a moisture-proof film covering: the lead wire; and a part of the piezoelectric element overlapped with the lead wire.
HETEROGENEOUS INTEGRATION CHIP OF MICRO FLUID ACTUATOR
A heterogeneous integration chip of a micro fluid actuator is disclosed and includes a first substrate, a first insulation layer, a first conductive layer, a piezoelectric layer, a second conductive layer, a second substrate, a control element, a perforated trench and a conductor. The first substrate includes a first chamber. The first insulation layer is disposed on the first substrate. The first conductive layer is disposed on the first insulation layer and includes an electrode pad. The piezoelectric layer and the second conductive layer are stacked on the first conductive layer sequentially. The second substrate is assembled to the first substrate through a bonding layer to define a second chamber and includes an orifice, a fluid flowing channel and a third chamber. The control element is disposed in the second substrate. The perforated trench filled with the conductor is penetrated from the electrode pad to the second substrate.
Liquid discharging head, liquid discharging apparatus, and method of manufacturing liquid discharging head
A liquid discharging head includes a pressure chamber partitioning portion that includes a plurality of partitioning walls that partition a pressure chamber in which a pressure to discharge a liquid is applied to the liquid, a diaphragm that includes a wall surface that faces the pressure chamber, The pressure chamber is located between the partitioning walls in a second direction. The wall surface of the diaphragm includes a first portion at a first position, and a second portion. A position of the second portion in the first direction is on an opposite side in the first direction with respect to a position of the first portion in the first direction.
Methods of fabricating micro-valves and jetting assemblies including such micro-valves
A method of constructing a micro-valve includes providing a substrate for an actuating beam of the micro-valve, the substrate including a first surface and a second surface. The method also includes forming a plurality of constituent layers on the first surface of the actuating beam, including a layer of piezoelectric material. The method also includes removing a portion of the substrate from at least one of the first surface or the second surface to define a cantilevered portion of the actuating beam. The method also includes providing an orifice plate including an orifice. The method also includes providing a valve seat on a surface of the orifice plate, the valve seat having an opening aligned with the orifice. The method also includes attaching the surface of the orifice plate to the second surface via an adhesive such that an overlapping portion of the cantilevered portion overlaps the orifice.
PHOTOSENSITIVE STRUCTURAL BODY AND METHOD OF PRODUCING THE PHOTOSENSITIVE STRUCTURAL BODY, AND INKJET RECORDING HEAD
Provided is a photosensitive structural body including: a substrate having a hydroxy group on a first surface thereof; and a cured product of a negative photosensitive resin composition arranged on the substrate, wherein the negative photosensitive resin composition contains an epoxy compound (A), a photobase generator (B), and an aromatic compound (C), and the aromatic compound (C) is a compound represented by the following general formula (1):
##STR00001##
in the general formula (1), four of R.sub.1 to R.sub.6 each independently represent a hydrogen atom or an alkyl group, and remaining two thereof each independently represent a functional group selected from an unsubstituted amino group (—NH.sub.2), a hydroxy group (—OH), and a carboxyl group (—COOH), provided that the two functional groups each selected from an unsubstituted amino group, a hydroxy group, and a carboxyl group are functional groups different from each other.
Element substrate, liquid ejection head, liquid ejection apparatus, and manufacturing method
An element substrate of a liquid ejection head includes an ejection element for ejecting a liquid, a plurality of electrode pads for receiving power for causing the ejection element to eject the liquid, and a sensor for detecting that the liquid has invaded the vicinity of the plurality of electrode pads. The sensor has first wiring connected with one electrode pad of the plurality of electrode pads and second wiring connected with one electrode pad different from the electrode pad connected with the first wiring.