A micro-valve includes an orifice plate including an orifice. The micro-valve further includes an actuating beam having a first end and a second end. The actuating beam also includes a base layer and a layer of piezoelectric material disposed on the base layer, a bottom electrode layer, and a top electrode layer. At an electrical connection portion of the actuating beam, the layer of piezoelectric material includes a first via, and a portion of the top electrode layer disposed within the first via, and a portion of the bottom electrode disposed beneath the first via. The actuating beam includes a base portion extending from the electrical connection portion and a cantilevered portion extending from the base portion. The cantilevered portion is movable in response to application of a differential electrical signal between the bottom electrode layer and the top electrode layer to one of open or close the micro-valve.

Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.

An inkjet printhead includes a head body in which a first fine channel that is connected to an ink inlet and thus guides an inflow of ink, a second fine channel that is disposed below the first fine channel, communicated with the first fine channel through a connection via hole, and guides an outflow of the ink by being connected to an ink outlet, and a nozzle that is opened downward from the second fine channel are defined, and a micro heater that is disposed closer to the connection via hole in an upper portion of the first fine channel than to an end of the first fine channel where the first fine channel is connected to the ink inlet or an end of the second fine channel where the second fine channel is connected to the ink outlet.

A method for producing a liquid-ejection head substrate includes forming a protective film covering the surface of a portion of a cavitation resistant film provided at a position where the heating resistor is covered with a metallic material containing at least one of titanium, tungsten, and titanium tungsten and etching the substrate after forming the protective film.

A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.

A piezoelectric device includes a piezoelectric body, a vibration plate that vibrates when the piezoelectric body is driven, a first electrode positioned between the piezoelectric body and the vibration plate, and a second electrode positioned to be separated from the first electrode by the piezoelectric body. The piezoelectric body has an active portion that is a part sandwiched between the first electrode and the second electrode in a first direction along a thickness direction of the piezoelectric body, and a change width of a dC/dV value, which represents a change in capacitance with respect to a change in a voltage applied along a second direction orthogonal to the first direction, from one end of the active portion on a side of the first electrode to the other end of the active portion on a side of the second electrode in the first direction is 10% or less.

A microfluidic device including a fluid ejection channel defined by a fluid barrier and an orifice, or nozzle, for containing and/or passing fluids, and further including micro-electromechanical systems (MEMS) and/or electronic circuitry may be fabricated on a silicon substrate and included in a fluid ejection system. Various microfabrication techniques used for fabricating semiconductor devices may be used to manufacture such microfluidic devices.

In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.