A mold remediation system includes a processor and an electromagnetic radiation source in communication with the processor. The electromagnetic radiation source is configured to emit radiation to heat a ferromagnetic material in or adjacent to a wall board upon which mold is located. The system also includes a temperature sensor in communication with the processor. The temperature sensor is configured to detect a temperature of the wall board. The processor is configured to compare the temperature of the wall board to a desired temperature to perform mold remediation.

A device for use in detecting metallic objects includes a processor and an electromagnetic radiation source in communication with the processor. The electromagnetic radiation source is configured to emit radiation to heat a metallic object. The device also includes a temperature sensor in communication with the processor. The temperature sensor is configured to detect heat emitted from the metallic object. The device also includes an alarm configured to notify an operator of the presence of the metallic object responsive to a determination by the processor that a temperature threshold has been exceeded.

A device for use in detecting metallic objects includes a processor and an electromagnetic radiation source in communication with the processor. The electromagnetic radiation source is configured to emit radiation to heat a metallic object. The device also includes a temperature sensor in communication with the processor. The temperature sensor is configured to detect heat emitted from the metallic object. The device also includes an alarm configured to notify an operator of the presence of the metallic object responsive to a determination by the processor that a temperature threshold has been exceeded.

A mold remediation system includes a processor and an electromagnetic radiation source in communication with the processor. The electromagnetic radiation source is configured to emit radiation to heat a ferromagnetic material in or adjacent to a wall board upon which mold is located. The system also includes a temperature sensor in communication with the processor. The temperature sensor is configured to detect a temperature of the wall board. The processor is configured to compare the temperature of the wall board to a desired temperature to perform mold remediation.

A mold remediation system includes a processor and an electromagnetic radiation source in communication with the processor. The electromagnetic radiation source is configured to emit radiation to heat a ferromagnetic material in or adjacent to a wall board upon which mold is located. The system also includes a temperature sensor in communication with the processor. The temperature sensor is configured to detect a temperature of the wall board. The processor is configured to compare the temperature of the wall board to a desired temperature to perform mold remediation.

A device for detecting an offending object such as weeds or insects, and addressing the offending object by removing or marking the same. The device has image acquisition and image recognition systems that captures images of plants and automatically responds by way of an action when a weed or insect is identified. The action head may grip the offending object or release a substance such a herbicide to eliminate a weed.

A device for detecting an offending object such as weeds or insects, and addressing the offending object by removing or marking the same. The device has image acquisition and image recognition systems that captures images of plants and automatically responds by way of an action when a weed or insect is identified. The action head may grip the offending object or release a substance such a herbicide to eliminate a weed.

An attracting assembly is positioned at an upper location to attract fleas. A killing assembly is positioned at an intermediate location beneath the attracting assembly to kill the attracted fleas. A moving assembly is positioned at a lower location beneath the killing assembly for maximizing the number of fleas attracted and killed.

An attracting assembly is positioned at an upper location to attract bed bugs. A killing assembly is positioned at an intermediate location beneath the attracting assembly to kill the attracted bed bugs. A base assembly is positioned at a lower location beneath the killing assembly for maximizing the number of bed bugs attracted and killed. A control assembly has a user visible digital UPC code, a battery power percentage indicator with an ON/OFF button and a sound activated switch, a cell phone with a macro-lens for wide angle photography with enlargements, and two light emitting diodes positioned adjacent to the macro-lens to illuminate bed bugs to be photographed.

A device for use in identifying an explosive includes a processor and an induction heat source in communication with the processor. The induction heat source is configured to emit radiation to heat a metallic component of an explosive device by way of induction. The device also includes a temperature sensor in communication with the processor that is configured to detect heat emitted from the metallic component of the explosive device. The processor is configured to identify a location of the metallic component of the explosive device based on the detected heat. A gas sensor is used to detect one or more gases emitted from a non-metallic explosive device. The device further includes an action arm configured to conduct a detonation attempt at the location of the metallic component of the explosive device.