Systems and methods are presented herein for a method of attaching a strip to a housing. An internal support member is inserted into a collapsible housing, such that it is arranged along a longitudinal axis of an inner surface of the collapsible housing. An outer support member is arranged along an outer surface the collapsible housing opposite the internal support member. A strip is positioned along the outer surface using the outer support member and the internal support member. Then the strip is permanently welded to the outer surface using a welding element. Welding is performed by a welding element located in one (or both) of the internal support member or the outer support member.

Provided a composite material forming method capable of easily using a composite material that is formed by causing a resin to react in a state where it is joined to another member; and a composite material. The composite material forming method includes a first material preparation step (magnetic field circuit forming material preparation step S11), a second material preparation step (magnetic field circuit non-forming material preparation step S12), a material assembly step S13, and a first heating step (magnetic field heating step S14). In the first material preparation step, a first material including a first resin is prepared. In the second material preparation step, a second material including a second resin is prepared. In the material assembly step S13, the first material and the second material are assembled to each other.

A welding method includes: moving a welding head toward a plurality of workpieces, wherein each of the plurality of workpieces includes a polymeric composite, the polymeric composite includes a polymer matrix and a plurality of fibers, and each of the fibers includes a magnetic material; applying a joining pressure to the workpieces with the welding head; applying energy to the plurality of workpieces to melt an interface between the plurality of workpieces, wherein a weld plane is defined at the interface between the plurality of workpieces; and applying a magnetic field to the plurality of workpieces to change an orientation of the plurality of fibers relative to the polymer matrix in the weld area so that the fibers in a weld area are at an angle relative to the weld plane.

A non-woven textile may be formed from a plurality of thermoplastic polymer filaments. The non-woven textile may have a first region and a second region, with the filaments of the first region being fused to a greater degree than the filaments of the second region. A variety of products, including apparel (e.g., shirts, pants, footwear), may incorporate the non-woven textile. In some of these products, the non-woven textile may be joined with another textile element to form a seam. More particularly, an edge area of the non-woven textile may be heatbonded with an edge area of the other textile element at the seam. In other products, the non-woven textile may be joined with another component, whether a textile or a non-textile.

A non-woven textile may be formed from a plurality of thermoplastic polymer filaments. The non-woven textile may have a first region and a second region, with the filaments of the first region being fused to a greater degree than the filaments of the second region. A variety of products, including apparel (e.g., shirts, pants, footwear), may incorporate the non-woven textile. In some of these products, the non-woven textile may be joined with another textile element to form a seam. More particularly, an edge area of the non-woven textile may be heatbonded with an edge area of the other textile element at the seam. In other products, the non-woven textile may be joined with another component, whether a textile or a non-textile.

A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.

A pair of thermoplastic resin members are placed on an anvil. A pressing force of a tool horn vibrating ultrasonically in a direction not perpendicular to but along upper surfaces of the pair of thermoplastic resin members is applied to the upper surfaces. The application of the pressing force of the tool horn vibrating ultrasonically allows melting of a vicinity of the upper surfaces of the pair of thermoplastic resin members. A welded structure part is formed on an unwelded structure part, thereby welding the pair of thermoplastic resin members as an overlap structure including the welded structure part arranged on the unwelded structure part. The distance and positional relationship between the pair of thermoplastic resin members after the welding are unchanged before and after the welding. The surfaces, placed on the anvil, of the thermoplastic resin members are neither burned nor discolored.

The invention relates to a device comprising a first fixing element, a further fixing element and a folded planar composite; wherein the first fixing element comprises a first fixing surface and the further fixing element comprises a further fixing surface; wherein the folded planar composite is at least partially fixed between the first fixing surface and the further fixing surface; wherein the folded planar composite comprises a first composite region; wherein the first composite region comprises a first layer sequence comprising a first composite layer comprising a first carrier layer, a second composite layer comprising a second carrier layer, a third composite layer comprising a third carrier layer and a fourth composite layer comprising a fourth carrier layer; wherein in the first composite region the second composite layer is joined to the third composite layer and the third composite layer is joined to the fourth composite layer; wherein in the first composite region the third carrier layer is characterised by a smaller layer thickness than in each case one selected from the group consisting of the first carrier layer, the second carrier layer and the fourth carrier layer or a combination of at least two of these; wherein the first fixing surface or the further fixing surface or both comprises a recess comprising a first recess region; wherein the first composite region is located at least partially between the first recess region and the first fixing surface or the further fixing surface.

A head for a horizontal flow wrapper packaging machine for forming a bandolier of product packages. The head includes a rotatable first shaft having a plurality of knife elements each including a blade and first and second upper crimping elements. The head also includes a rotatable second shaft having a plurality of anvil elements. A rotation speed of the second shaft is independent of the rotation speed of the first shaft. Each anvil element includes perforation and cutting surfaces and first and second lower crimping elements. A rotation speed of either the first shaft or second shaft is changed to move either a knife element or an anvil element, respectively, between a perforation position and a cutting position. The first upper and first lower crimping elements and the second upper and second lower crimping elements also mate to crimp the packaging material in either the perforating or cutting positions.

A method and installation for joining a cover layer to an object in a continuous process. Joining is effected with the aid of a joining material having thermoplastic properties, wherein the joining material is arranged between the cover layer and the object and is liquefied using ultrasonic vibration energy. Before application of the ultrasonic vibration energy, the joining material is preheated in a contactless manner with the aid of electromagnetic induction in the region of the glass transition temperature of the joining material or above this glass transition temperature. The object is in particular a chip board and the cover layer an edge strip to be joined to an edge of the chip board.