The present invention is directed to a method forming a bottom-gusseted package, wherein each package includes an inwardly-extending, pleat-like gusset at the bottom of the package. To permit heat-sealing formation of each package, the sleeve from which each gusset is formed comprises a lamination of two differing polymeric materials, so that only an exterior surface of each sleeve exhibits the desired heat-sealing characteristics. To facilitate package formation, the sleeves from which the bottom gussets are formed are maintained in a temporarily closed or sealed configuration during package formation by providing a preferably frangible bond or seal at the edge of each sleeve. This result is preferably achieved by folding the laminate material, and temporarily sealing or joining an outer layer of the laminate material from which gusset is formed, while an inner layer is maintained in an unsealed condition.

A method of making a storage bag comprising the following steps performed in any order: (a) forming a composite tube having an inner surface comprising a higher melting polymer, an outer surface comprising a lower melting polymer, two ends, and a diameter; (b) flattening the tube in a direction perpendicular to the diameter; (c) forming a joint at one of the ends at a temperature between respective melting points of the higher melting polymer and the lower melting polymer; (d) providing a composite sheet having a first side comprising a higher melting polymer and a second side comprising a lower melting polymer; and (e) disposing the composite sheet over the joint such that the first side comprising a lower melting polymer engages the joint and forming a lap seam over the joint at a temperature between respective melting points of the higher melting polymer and the lower melting polymer, and a storage bag made by such method.

A method for manufacturing a metal-clad laminate sheet containing (i) a thermoplastic liquid crystal polymer film comprising a thermoplastic polymer, and (ii) a metal foil bonded to at least one surface of the thermoplastic liquid crystal polymer film, the thermoplastic polymer being capable of forming an optically anisotropic molten phase, and the method containing: forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2): (1) wheat treatment temperature ranges between 1 C. inclusive and 50 C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and (2) a time for the heat treatment ranges from one second to 10 minutes.

A method for manufacturing a multilayer circuit board containing a single-sided metal-clad laminate sheet and a substrate laminated together, the single-sided metal-clad laminate sheet containing a thermoplastic liquid crystal polymer film and a metal foil bonded to a surface of the thermoplastic liquid crystal polymer film, and the method containing: forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2) to manufacture the single-sided metal-clad laminate sheet: (1) a heat treatment temperature ranges between 1 C. inclusive and 50 C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and (2) a time for the heat treatment ranges from one second to 10 minutes.

A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The insulative sidewall, of the subassembly, and the second section, of the interfacial layer, are each formed from a material that is not a fluoropolymer. A recess is formed in the first section of the interfacial layer and the second section of the interfacial layer extends within the recess.

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

A method and apparatus for forming pouches and/or bags is disclosed. A seal and/or insert is crushed using a multiphase sealer or crusher.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

The present disclosure is concerned with a method of forming a seal with a polyethylene based film structure. The polyethylene based film structure has at least one layer formed with an oriented polyethylene having a predetermined melting temperature (T.sub.m). A conductive heat sealing device provides heat to form the seal, where a first sealing bar of the conductive heat sealing device operates at a first operating temperature of at least 10 degrees Celsius (? C.) below the T.sub.m of the oriented polyethylene in the polyethylene based film structure and a second sealing bar of the conductive heat sealing device operates at a second operating temperature of at least 15? C. higher than the operating temperature of the first sealing bar. The seal formed with the polyethylene based film structure retains at least 99 percent of its original surface area prior to forming the seal.

There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.