According to a method or an apparatus for fastening bristles in a bristle carrier (10) without using an anchor a heating (39) is provided in a tool part configured to transport the bristles. After inserting the bristles into anchoring openings (12) in the bristle carrier (10), the anchoring openings are closed by applying pressure.

The invention relates to an acrylic layer (in the form of a coating, film or sheet) useful as part of a photovoltaic module backsheet. The acrylic layer contains at least 40 percent of one or more acrylic polymers, including an acrylic polymer matrix and optionally acrylic impact modifiers. The acrylic polymer is preferably a polymer, copolymer, or terpolymer containing at least 50 weight percent of methylmethacrylate monomer units. The acrylic layer is flexible and optionally contains high levels of white pigment. It may also contain fluoropolymers such as polyvinylidene fluoride to improve weathering, processibility and film formation. The acrylic layer adheres to a polymer support layer such as polyethylene terephthalate (PET). A preferred substrate is PET that is pre-treated to improve adhesion, but unprimed PET can also be used. The backsheet provides excellent weatherability, environmental stability and reflectivity as part of a photovoltaic module.

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

A structural assembly (900) and method of fabricating the same, the method comprising: providing a first member (204) comprising a bond surface (800) and a plurality of protrusions (802) extending from the bond surface (800), a length of each of the protrusions (802) from the bond surface (800) being less than or equal to 2 mm; providing a second member (202) comprising a fibre-reinforced composite material, the fibre-reinforced composite material comprising a plurality of elongate fibres (902) embedded in a polymer matrix (904); while the polymer matrix (904) is in its plastic state, forcing the second member (202) against the bond surface (800) and the protrusions (802) so as to cause the second member (202) to form onto the bond surface (800) and the protrusions (802); and thereafter causing the polymer matrix (904) to harden, thereby fixing the first member (204) to the bond surface of the second member (202).

It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.

A method of forming a device having a compliant member includes applying heat to a thermoplastic elastomer to maintain the thermoplastic elastomer in a softened state. The thermoplastic elastomer is extruded in the softened state as a film of thermoplastic elastomer. One or more of a bobbin and a housing, each having and end, is positioned such that the end extends at least partially into the film of thermoplastic elastomer. The positioning occurs when the thermoplastic elastomer is in the softened state and/or the bobbin and/or housing is at a temperature that is greater than a temperature of the film of thermoplastic elastomer. The film is cooled so that the bobbin and/or housing are secured to the film and so that the thermoplastic elastomer is in a state that exhibits rubber-like properties.

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

Methods of producing polymer-metal hybrid components that are bonded by CO-M bonds at the interface using at least one of the hot pressing, rolling, and injection molding methods to create chemical bond formation conditions at the polymer and metal interface. When the thermal cycle and compressive pressure specified herein is combinationally created at the polymer and metal interfaced, strong CO-M bonds forms at the interface and strongly bonds the metal and polymer together through the reaction carbonyl groups (CO) in polymer and the metal surface. For polymers lacking enough carbonyl groups, new functional groups can be in-situ generation through introducing distributed air pockets at the polymer-metal interface for forming 3-dimensional distributed CO-M bonds at the interface.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

A method and installation for joining a cover layer to an object in a continuous process. Joining is effected with the aid of a joining material having thermoplastic properties, wherein the joining material is arranged between the cover layer and the object and is liquefied using ultrasonic vibration energy. Before application of the ultrasonic vibration energy, the joining material is preheated in a contactless manner with the aid of electromagnetic induction in the region of the glass transition temperature of the joining material or above this glass transition temperature. The object is in particular a chip board and the cover layer an edge strip to be joined to an edge of the chip board.