A medical device includes a scaffold crimped to a catheter having an expansion balloon. The scaffold is crimped to the balloon by a process that includes inflating the delivery balloon during a diameter reduction to improve scaffold retention and maintaining an inflated balloon during the diameter reduction and prior and subsequent dwell periods.

Disclosed is a method of joining resin members that includes: forming a coating layer by applying a solvent to a surface of a resin member, the solvent allowing the thermoplastic resin to have a degree of swelling of 1.05 or more and 3.00 or less when the thermoplastic resin is swollen by the solvent, and having a boiling point B? C. of R ? C. or lower where R ? C. is a glass transition temperature of the thermoplastic resin; laminating resin members one another via the coating layer to form a laminate; and pressing the laminate in the lamination direction while heating at a heating temperature H ? C. that is equal to or lower than R ? C.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

A process for welding a first molding to a second molding. The process uses an implement including first and second external surfaces. Each external surface further includes a duct. An end of the first molding is heated by a hot gas while the end is at a distance from the duct-entry plane in the range from 3 mm outside the duct to 10 mm inside the duct. A junction area of the second molding is heated by a hot gas while the junction area is at a distance from the duct-entry plane in a range from 3 mm outside the duct to 10 mm inside the duct. The heated end and the heated junction area are then brought into contact with one another and cooled, forming a weld between the first molding and the second molding. Also disclosed is a welded molding obtainable by the process of the invention.

The invention relates to a filter device for the exchange of substances, comprising a pipe section-shaped housing with a center of gravity and with two housing ends, in which housing a hollow fiber bundle consisting of semi-permeable membranes is arranged, comprising, furthermore, an end cap having a first and second opening, wherein the housing and the end cap configure a first sealing surface which connects the housing and the end cap sealingly, and wherein the first sealing surface is spaced apart further from the center of gravity of the housing than the aperture, and wherein a first fluid chamber is formed between the first sealing surface and the first opening of the end cap, via which first fluid chamber the first opening is connected to the first flow chamber, wherein the housing and the one end cap configure a second sealing surface, wherein the first and second sealing surface are not configured by way of a sealant.

A method is provided for connecting a fitting to a reinforced thermoplastic duct including inserting a first end of the fitting having a plurality of barbs into an end of the duct. A clamp is installed around the duct. The duct is heated to a temperature greater than a glass transition temperature of a thermal plastic material used to form the duct. The duct is restructured to include a plurality of protrusions positioned between the plurality of barbs of the fitting.

A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide20 C. to the glass transition temperature Tg+50 C.

A method of manufacturing magnets and a method of manufacturing a rotor are provided. An intermediate member includes a sheet and magnet bodies. The sheet includes a first sheet surface and a second sheet surface on a side opposite to the first sheet surface. The magnet bodies are located on the first sheet surface. A first die is made of an elastic material having an elastic coefficient lower than the elastic coefficient of the magnet bodies. The intermediate member is arranged between the first die and a second die such that the second sheet surface of the sheet faces the first die. The first die and the second die hold the intermediate member in between. Accordingly, the sheet is cut at positions between adjacent ones of the magnet bodies.

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.