An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of contact pads, a plurality of pulldown devices, and control logic. The plurality of contact pads include a first contact pad and a second contact pad. Each of the pulldown devices is electrically coupled to a corresponding contact pad. The control logic enables at least a portion of the pulldown devices in response to both a logic low signal on the first contact pad and a logic low signal on the second contact pad.

A device, comprising a plurality of units arrayed in a predetermined direction, a first terminal configured to supply a voltage to the plurality of units, and a second terminal configured to supply a voltage to the plurality of units, wherein the plurality of units include a first unit including a memory element arranged between the first terminal and the second terminal, and a first transistor configured to perform write to the memory element, and a second unit including a second transistor arranged between the first terminal and the second terminal in correspondence with the first transistor of the first unit.

A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.

The present invention is targeted at suppressing ringing and overvoltage. A driver circuit (200) drives a plurality of loads (Z.sub.1 to Z.sub.N). A plurality of output terminals (Po.sub.1 to Po.sub.N) are connected to the plurality of loads (Z.sub.1 to Z.sub.N). A plurality of drivers (Dr.sub.1 to Dr.sub.N) correspond to the plurality output terminals (Po.sub.1 to PO.sub.N), and generate driving signals (Vo.sub.#) applied to the respectively corresponding load (Z.sub.#). A plurality of clamp circuits (260_1 to 260_N) correspond to the plurality of drivers (Dr.sub.1 to Dr.sub.N), and include Schottky diodes (SD) connected to input nodes or output nodes of the respectively corresponding drivers (Dr).

An integrated circuit to drive a plurality of fluid actuation devices includes a contact pad and a programmable pulldown device. The programmable pulldown device is electrically coupled to the contact pad. The programmable pulldown device is settable to any one of a plurality of resistances.

A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.

A manufacturing method of narrow type inkjet print head chip is provided and includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.

An ink-jet head driving circuit includes: PMOS transistors each of which has an Nwell area, a drain terminal and a source terminal, the PMOS transistors connected to a piezoelectric element for jetting ink from a nozzle; and an NMOS transistor connected to the drain terminals of the PMOS transistors. The source terminals and Nwell areas of the PMOS transistors are connected respectively to power sources, and voltage of one of the power sources connected to the Nwell area of each of the PMOS transistors is equal to or higher than the highest voltage of the power sources connected to the source terminals of the PMOS transistors.

An apparatus includes a substrate, a transistor provided on the substrate and connected to a first terminal supplied with a first voltage, an anti-fuse element provided on the substrate and connected between the transistor and a second terminal supplied with a second voltage, a first resistive element provided on the substrate and connected in parallel to the anti-fuse element and between the transistor and the second terminal, and an adjusting unit provided on the substrate and configured to function so as to reduce an influence of variation in resistance of the first resistive element in reading out of information from the anti-fuse element.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of contact pads, a plurality of pulldown devices, and control logic. The plurality of contact pads include a first contact pad and a second contact pad. Each of the pulldown devices is electrically coupled to a corresponding contact pad. The control logic enables at least a portion of the pulldown devices in response to both a logic low signal on the first contact pad and a logic low signal on the second contact pad.