A plurality of element arrays are formed between a first terminal array and a second terminal array by a plurality of elements. An element array positioned closer to the second terminal array than to the first terminal array is connected to the second terminal array. An element array positioned closer to the first terminal array than to the second terminal array is connected to the first terminal array.

A printing apparatus includes: power supply circuits including at least a first power supply circuit and a second power supply circuit, the power supply circuits having mutually different output voltages; and a head including nozzles, the nozzles forming groups arranged in a first direction, each of the nozzles being associated with any one of the power supply circuits. The groups include a first group and a second group adjacent to each other in the first direction. The first group is formed by nozzles associated with the first power supply circuit and nozzles associated with the second power supply circuit. The second group is formed by nozzles associated with the first power supply circuit and nozzles associated with the second power supply circuit.

To operate a printing apparatus with small power, the printing apparatus for printing an image on a print medium using power of an electric storage charged by power input from an external power supply performs the following control. An operation sequence for printing on the print medium is divided into a plurality of sequences. Each of the divided sequences is executed by discharging power charged in the electric storage. Next, power is charged in the electric storage during a standby time of the operation sequence after execution of one divided sequence ends. An electric storage amount charged in the electric storage is compared with a predetermined threshold. Then, control is performed to execute the next sequence in a case where the electric storage amount becomes larger than the predetermined threshold.

A method of operating a printing device during a power loss event includes, with a power loss detection device, detecting an power loss to a number of high voltage devices. The method further includes, with a voltage regulator coupled to printhead fire control circuitry, maintaining a power loss protection supply voltage (V.sub.DD.sub._plp) to the printhead fire control circuitry.

A liquid discharge head substrate includes a first heater row including a plurality of heaters arranged in a first direction, a first transistor configured to drive a first heater of the plurality of heaters, and a second transistor configured to drive the first heater. The first heater is arranged between the first transistor and the second transistor in a second direction crossing the first direction.

An ink-jet head driving circuit includes: PMOS transistors each of which has an Nwell area, a drain terminal and a source terminal, the PMOS transistors connected to a piezoelectric element for jetting ink from a nozzle; and an NMOS transistor connected to the drain terminals of the PMOS transistors. The source terminals and Nwell areas of the PMOS transistors are connected respectively to power sources, and voltage of one of the power sources connected to the Nwell area of each of the PMOS transistors is equal to or higher than the highest voltage of the power sources connected to the source terminals of the PMOS transistors.

A control circuit includes a memory interface and a power interface. The control circuit is configured to: read out identifiers and voltage values from a memory via the memory interface, the memory storing the identifiers and the voltage values associated with the identifiers, the identifiers identifying actuators for jetting liquid, the voltage values corresponding to values of voltages to be supplied to the actuators; based on the voltage values, associate each of the identifiers with one of power circuits; detect whether failure occurs in any of the power circuits via the power interface communicated with the power circuits each changeable in output voltage; and based on detection of the failure occurring in any power circuits, associate specified identifiers with a non-failure power circuit in which the failure does not occur, the specified identifiers associated with a failure power circuit in which the failure is detected.

A fluid ejection device includes a fluid slot, a plurality of fluid ejection chambers communicated with the fluid slot, a plurality of drop ejecting elements one of each within one of the fluid ejection chambers, a plurality of fluid circulation channels each communicated with the fluid slot and one or more of the fluid ejection chambers, and a plurality of fluid circulating elements each communicated with one or more of the fluid circulation channels. The fluid circulating elements are to provide intermittent circulation of fluid from the fluid slot through the one or more of the fluid circulation channels and the one or more of the fluid ejection chambers.

A drive circuit that drives a piezoelectric device including a drive signal selection control circuit which controls supply of the drive signal to the piezoelectric element, the drive circuit including a drive signal output circuit that outputs the drive signal, a power supply voltage signal output circuit that outputs a power supply voltage signal, and a power supply voltage control circuit that controls supply of the power supply voltage signal to the drive signal selection control circuit, in which the drive signal output circuit includes a modulation circuit, an amplification circuit, a demodulation circuit, a feedback circuit, and a discharge circuit, a first wiring electrically couples the drive signal selection control circuit and the power supply voltage control circuit to each other, and the discharge circuit is electrically coupled to a second wiring through which the drive signal output from the demodulation circuit propagates, through the feedback circuit.

One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.