B41J2/0458

Logic Circuitry

This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.

Bubblers to provide sequential fluid flow

An example device includes a first chamber to contain a first fluid and a second chamber to contain a second fluid. The first chamber includes a first fluid outlet, and a first bubbler to ingest bubbles into the first chamber when pressure in the first chamber overcomes a first bubble pressure of the first bubbler. The second chamber includes a second fluid outlet, and a second bubbler to ingest bubbles into the second chamber when pressure in the first chamber overcomes a second bubble pressure of the second bubbler. An outlet node is fluidly connected to the first fluid outlet and the second fluid outlet. The outlet node draws the first fluid from the first chamber when the first bubbler ingests bubbles, and sequentially draws the second fluid from the second chamber when the second bubbler ingests bubbles.

Printing apparatus and head temperature correction method

A printing apparatus includes a printhead with a plurality of print elements for generating energy used for printing an image on a print medium, a first temperature detection element and a second temperature detection element at positions different in a direction of a print element array in which the plurality of print elements are arrayed. The apparatus corrects a signal concerning a head temperature based on an output from the first temperature detection element, and corrects, based on the corrected signal concerning the head temperature, a signal concerning a head temperature output from the second temperature detection element.

PRINT ELEMENT SUBSTRATE, PRINTHEAD, AND PRINTING APPARATUS
20210379889 · 2021-12-09 ·

A print element substrate, comprising a plurality of heating elements, a plurality of detection elements, each configured to detect a temperature of a corresponding heating element, a first current generation unit, a second current generation unit, and a signal output unit, wherein one of the first and second current generation units supplies a current to a first detection element, the other supplies a current to a second detection element, and the signal output unit outputs a signal according to a potential difference between one terminal of the first detection element on a side where a potential variation occurs upon supply of the current and one terminal of the second detection element on a side where a potential variation occurs upon supply of the current.

Printing apparatus and method of controlling same

Although a conventional method of inspecting an ink discharge state in which the temperature change of the heater is detected enables accurate and high-speed inspection, due to the situation in which the inspection was performed, appropriate post-processing depending on the situation cannot be executed based on a result of the inspection. Therefore, it is necessary to determine the ink discharge state in detail. A plurality of modes are provided in accordance with the purpose of performing an inspection of the ink discharge state, and a discharge inspection threshold is provided for each of these modes. By selectively executing or continuously executing these modes, it is possible to determine the ink discharge state in more detail.

LOGIC CIRCUITRY PACKAGE

A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.

FLUIDIC DIE WITH SURFACE CONDITION MONITORING

One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.

LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE DEVICE
20210370669 · 2021-12-02 ·

A liquid discharge head, comprising an insulating member arranged on a substrate, a resistive heating element arranged in the insulating member and configured to generate thermal energy used to discharge a liquid, a bubble chamber provided above the insulating member and configured to generate bubbles of the liquid based on the thermal energy, and a temperature detection element capable of detecting a temperature in the bubble chamber, wherein the temperature detection element is arranged between the resistive heating element and the bubble chamber and in a conductive layer closest to the bubble chamber in a plurality of conductive layers provided with respect to the insulating member.

PRINT ELEMENT SUBSTRATE, PRINTHEAD, AND PRINTING APPARATUS
20210370670 · 2021-12-02 ·

A print element substrate, comprising a base, a heater provided on the base and configured to generate heat used to discharge ink, a flow path member, which forms an ink flow path, configured to form, together with the base, a bubbling chamber in which the ink is bubbled by the heat of the heater provided in a bottom surface of the bubbling chamber, and a temperature sensor capable of detecting a temperature of the bubbling chamber, the temperature sensor being formed of the same material as the heater and provided in the same layer as the heater on the base.

LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND LIQUID EJECTING METHOD
20220203676 · 2022-06-30 ·

A liquid ejecting head includes: a first pressure chamber to which a first liquid is supplied; a first drive element that applies pressure to the first liquid in the first pressure chamber; a second pressure chamber to which a second liquid is supplied; a second drive element that applies pressure to the second liquid in the second pressure chamber; a nozzle channel which has one end communicating with the first pressure chamber and another end communicating with the second pressure chamber and in which the first liquid supplied from the first pressure chamber and the second liquid supplied from the second pressure chamber are mixed; and a nozzle that is provided in the nozzle channel and ejects a mixture of the first liquid and the second liquid.