A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

A recording apparatus that performs recording on a recording medium, includes a liquid discharge head including a plurality of element substrates each having a discharge port configured to discharge liquid and a heat element configured to heat the liquid, a channel member including a common supply channel configured to communicate with the plurality of the element substrates and to supply the liquid to the plurality of the element substrates, and a common collecting channel configured to communicate with the plurality of the element substrates and to collect the liquid from the plurality of the element substrates, wherein the common supply channel and the common collecting channel are respectively disposed out of alignment in a conveyance direction of the recording medium, and wherein, upstream of the element substrates, the recording apparatus comprises a heat unit configured to heat the liquid flowing in the common supply channel.

A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A wafer structure is disclosed and includes a chip substrate and an inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the inkjet chip. The inkjet chip includes plural ink-drop generators generated by the semiconductor process on the chip substrate. Each of the plurality of ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches.

A mobile printing robot includes a windbreak to reduce wind-induced deflection of ink droplets emitted from a printhead of the mobile printing robot. The printhead may have a comparatively large throw height to aid in permitting obstacles, such as particles from safely passing under the printhead without damaging the printhead or cause the printhead to become stuck. The windbreak may be implemented using resiliently compliant sections that block the wind but accommodate the passage of particles or other obstacles.

This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.

Although a conventional method of inspecting an ink discharge state in which the temperature change of the heater is detected enables accurate and high-speed inspection, due to the situation in which the inspection was performed, appropriate post-processing depending on the situation cannot be executed based on a result of the inspection. Therefore, it is necessary to determine the ink discharge state in detail. A plurality of modes are provided in accordance with the purpose of performing an inspection of the ink discharge state, and a discharge inspection threshold is provided for each of these modes. By selectively executing or continuously executing these modes, it is possible to determine the ink discharge state in more detail.

A thermal jet printhead die includes thermal zones. For each thermal zone, the printhead die includes a pair of relative size-scaled temperature sensors to differentially sense a temperature of the thermal zone. A scaling factor between the pair of relative size-scaled temperature sensors for each thermal zone is matched across the thermal zones.

The present invention provides a fine bubble generating apparatus capable of generating fine bubbles efficiently. The present invention includes a fluid flow passage that includes a narrow portion in at least a part thereof, a heating part capable of heating a liquid flowing through the fluid flow passage, and a controlling unit that controls the heating part. The controlling unit controls the heating part to generate film boiling in the liquid to generate ultrafine bubbles.

A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.