A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

According to examples, an apparatus may include fluid chambers that each includes a fluid actuator and an electrode. The fluid actuators may operate at a first voltage level and a monitoring circuitry may operate at a second voltage level that is lower than the first voltage level. The monitoring circuitry may monitor a condition of each fluid chamber based on a selection signal for selecting an electrode associated with a fluid chamber. The monitoring circuitry including an analog multiplexer that includes, for each of the electrodes for the plurality of fluid chambers, a level shifter to receive the selection signal at the second voltage level and to shift a level of the selection signal. The analog multiplexer may also include an analog pass gate to selectively couple the electrode of a respective fluid chamber to the monitoring circuitry based on the level shifted selection signal.

A fluid dispensing system with a fluid cartridge having a fluid reservoir and an ejection head. The ejection head has fluid ejectors that are in fluid flow communication with the fluid reservoir. A fluid detection circuit is electrically connected to at least one of the fluid ejectors. The fluid detection circuit is configured to detect and characterize a fluid in the fluid ejector, where the fluid detection circuit characterizes the resistivity of the fluid by adjusting an ejector voltage of the at least one of the fluid ejectors.

A printing apparatus comprising a printing element substrate, including a substrate including a heating element for heating and discharging liquid and a temperature detecting element for detecting a temperature of the substrate, wherein a detection period, during which a detecting result is obtainable, extends across a plurality of cycles of a latch signal, and a heating enabling signal for discharging the liquid and the latch signal are output such that, in the detection period, an output value of a temperature waveform does not exceed a preset threshold value, the temperature waveform being a temperature waveform of the substrate detected by the temperature detecting element.

A liquid discharge apparatus includes: a liquid discharge head configured to discharge a liquid from a nozzle, the liquid discharge head including: a liquid chamber communicating with the nozzle; a pressure generator configured to deform the liquid chamber to apply pressure to the liquid in the liquid chamber; and circuitry configured to apply a drive signal to the pressure generator to drive the pressure generator, the drive signal including at least one drive pulse. The drive pulse includes: an expansion element to expand the liquid chamber to a first volume; a holding element to hold the first volume of the liquid chamber expanded by the expansion element for a predetermined time; and a contraction element to contract the liquid chamber from the first volume held by the holding element to a second volume.

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a number of zones. Each zone includes a number of sets of fluidic devices. Each fluidic device includes a fluid chamber and a fluid actuator disposed in the chamber. Each fluidic device also includes a sensor to sense a characteristic of the zone and an adjustment device. The adjustment device 1) delays a firing signal received from a previous zone as it passes by each set of fluidic devices and 2) adjusts the firing signal as it enters the zone based on a sensed characteristic.

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.

One embodiment of the present invention is a liquid ejection apparatus having: a liquid ejection head including a heating element, a first protection layer that blocks contact between the heating element and liquid, a second protection layer that partially covers the first protection layer and functions as a first electrode, a second electrode that is electrically connected to the first electrode through the liquid, and an ejection port that ejects the liquid; and a control unit configured to perform control of setting a potential difference between the first electrode and the second electrode to a predetermined value in each of aging and printing by changing at least one of potentials of the first electrode and the second electrode, wherein ΔVa≠ΔVp is satisfied in the case where the potential difference in the aging is represented by ΔVa and the potential difference in the printing is represented by ΔVp.

Examples include a fluidic die. The fluidic die comprises an array of field effect transistors. Connecting members electrically connect at least some of the field effect transistors of the array of field effect transistors, and the field effect transistors of the array are arranged into respective sets of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having a first number of field effect transistors. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a second number of field effect transistors that is different than the first number of field effect transistors.

A thermal inkjet printing device includes a fluidic die having a thermal sensor and a processor coupled to the fluidic die. The processor is to receive temperature data from the thermal sensor and determine a flow rate of liquid printing agent through the fluidic die based on the temperature data and an operating parameter for the fluidic die.