The invention relates to a die for depositing a conductive fluid onto a substrate, including a structure (11) for supporting at least one fluid (13) which is conductive and the viscosity of which sensitive to the radiation from a light source (5), in order to deposit said fluid (13) onto a substrate (3) so as to form conductive contacts or tracks on the substrate (3). The support structure (11) includes at least one tank (17) for said conductive fluid, the bottom wall (19) of which is to be arranged opposite said substrate (3) during the deposition, and said bottom wall (19) has perforations for enabling the flow (18) of said conductive fluid (13) onto the substrate (3) when said fluid (13) is subjected to the radiation (15) from said light source (5), wherein the perforations are formed according to a pattern of the fluid to be deposited onto the substrate (3). The die (7) further comprises an optical plate (9) having a pattern (30) pervious to the radiation from said light source (5), the optical plate (9) being impervious to the radiation from said light source (5) outside said pattern (30), while the pattern (30) pervious to the radiation from said light source on said optical plate (9) corresponds to a pattern covering the pattern (22) of the perforations of said support structure.

A liquid discharging head includes a nozzle plate having a plurality of nozzles from which liquid is discharged; a plurality of individual liquid chambers that are communicably connected to the plurality of nozzles, respectively; a common liquid chamber that supplies liquid to the plurality of individual liquid chambers; and a circulation common liquid chamber that leads to a plurality of circulation channels. A part of the common liquid chamber overlaps the circulation common liquid chamber from a direction in which liquid is discharged from the nozzles, and another part of the common liquid chamber overlaps the circulation common liquid chamber from a direction orthogonal to both the direction in which liquid is discharged from the nozzles and a direction in which the nozzles are aligned.

The invention relates to a direct printing method for enamelling and/or decorating on surfaces in general (ceramic, glass or metallic materials, inter alia), which are subjected to heat treatment following printing, consisting of transferring an enamel/ink, by means of the use of a device for emitting energy in the form of electromagnetic waves, preferably laser, from a carrier vehicle to the printing surface without any contact between said vehicle and the printing surface. The heat treatment, which is carried out at temperatures higher than 500 C., is used for the adherence of the enamel/ink to the substrate, producing the final ceramic and/or chromatic effect.

A label modification unit may receive a label modification input that indicates a label modification associated with content being written to a label or erased from the label. The label modification unit may identify an area of the label that is associated with the label modification according to the label modification input. The label modification unit may determine, based on a size of the area, a spot size of a light beam that is configured to be emitted by a laser printhead to modify the content within the area. The label modification unit may determine, based on the spot size and the content, an optical path configuration for the laser printhead. The label modification unit may operate the laser printhead according to the optical path configuration to write the content to the area or erase the content from the area.

A fluid ejection device includes: a fluid chamber; a volume varying unit configured to vary the volume of the fluid chamber; a fluid supplying unit configured to supply fluid to the fluid chamber at a predetermined pressure; and an ejection command switching unit configured to switch a fluid ejection between a pulsed flow ejection which ejects the fluid in a pulsed manner by activating the volume varying unit and varying the volume of the fluid chamber and a continuous flow ejection which ejects the fluid with a fluid supply pressure from the fluid supplying unit higher than that in the case of the pulsed flow ejection in a state in which the volume varying unit is stopped.