A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.

Provided is an electric wiring member supported by a support member that supports a recording element substrate configured to eject a liquid. The electric wiring member has a signal line for transmitting a drive signal used for driving the recording element substrate, a power line for supplying drive power to the recording element substrate, and a heat generating resistive line for heating the support member. The power line is arranged between the signal line and the heat generating resistive line.

Fluid ejection devices with multiple activation modes are disclosed. An example printhead assembly includes a fluid ejection nozzle, a first resistor fluidically coupled to the fluid ejection nozzle, and a second resistor fluidically coupled to the fluid ejection nozzle. The example printhead also includes an addressing circuit to receive a nozzle address and an activation mode to activate the fluid ejection nozzle. The activation mode determines which of the first resistor and the second resistor are to be energized.

A thermal inkjet dye sublimation ink consists of a disperse dye colorant dispersion, primary and secondary solvents, a chelating agent, oleth-3-phosphate, additive(s), and water. The colorant dispersion is present in an amount ranging from about 1 wt % actives to about 7 wt % actives. The amount of the primary solvent (glycerol, ethoxylated glycerol, 2-methyl-1,3-propanediol, dipropylene glycol, or combinations thereof) ranges from about 10 wt % to about 22 wt %, and the amount of the secondary solvent ranges from 0 wt % to about 7 wt %. The chelating agent amount ranges from 0 wt % actives to less than 0.1 wt % actives, and the oleth-3-phosphate amount ranges from about 0.1 wt % to about 0.75 wt. The additive is selected from the group consisting of a buffer, a biocide, another surfactant, and combinations thereof.

An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.

A thermal bubble inkjet printhead including a substrate, a plurality of control elements, a plurality of heaters, an ink barrier and a nozzle plate is provided. The control elements are disposed on the substrate. The heaters are electrically connected to the control elements. The material of the heaters is a transparent conductive material. The ink barrier is disposed on the heater and has a plurality of ink chambers. Each of the ink chambers overlaps one of the heaters. The nozzle plate is disposed on the ink barrier and has a plurality of nozzles. Each nozzle overlaps one of the ink chambers.

A liquid discharge head includes: an actuator substrate; an electromechanical transducer held by the actuator substrate; a damper; and a damper holding substrate holding the damper, wherein the damper disposed between the actuator substrate and the damper holding substrate and joined to the actuator substrate and the damper holding substrate with an adhesive, the damper has a joint portion having a recess or a through hole.

Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.

According to examples, an apparatus may include a fluidic chamber, in which fluid is to be temporarily held. The apparatus may also include a heating component to generate heat to form a drive bubble in the fluid held in the fluidic chamber and a cavitation plate may be provided between the fluidic chamber and the heating component. The cavitation plate may be in communication with the fluidic chamber and may physically separate the fluidic chamber from the heating component to protect the heating component. In addition, a controller may determine a condition in the fluidic chamber based on an electrical signal received from the cavitation plate.