A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A liquid discharge head includes: a nozzle plate having a nozzle from which a liquid is to be discharged in a discharge direction, the nozzle having a cylindrical hole having periodical convex portions and concave portions on a sidewall of the nozzle in the discharge direction, a diameter of an outermost portion of the nozzle in the discharge direction being smaller than an average diameter of minimum values and maximum values of diameters of the cylindrical shape. The average diameter is obtained by: Average diameter = (Sum of minimum values + Sum of maximum values) / (Count of minimum values + Count of maximum values).

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

Atomic-to-Nanoscale Matter Emission/Flow Regulation Devices, Systems and methods are set forth. An exemplary device can include a through-hole that has a top, and a nozzle configured to facilitate atomic-to-nanoscale matter emission/flow regulation formed in an etchable nozzle substrate. The nozzle can be configured at the smallest cross-section of the through-hole. A bottom can be formed in the nozzle substrate or selectively connected to the nozzle. Systems can include matter transportation/flow regulation columns, printing systems, etching systems and the like through which self-aligned nanodroplets or single-to-finite numbered ionic species/gas phase matter can flow under spontaneous or external excitation conditions (such as voltages) at atmospheric as well as regulated pressures.

A channel member includes a first substrate in which a channel is formed from a first surface, and a second substrate having a second surface facing the first surface, wherein the first substrate and the second substrate are bonded to each other with an adhesive between the first surface and the second surface, wherein the channel has a polygonal shape when viewed from a direction orthogonal to the first surface, wherein the channel includes a first portion on the first surface side and a second portion that communicates with the first portion, wherein an aperture area of the second portion is larger than an aperture area of the first portion when viewed from the direction orthogonal to the first surface, and wherein the adhesive is present on a step surface between the first portion and the second portion and at vertices of the polygonal shape.

A flow path member includes a first substrate, a second substrate, bonding adhesive, and recessed portions. The first substrate has a first surface formed with an opening of a flow path. The second substrate has a second surface facing the first surface. The bonding adhesive bonds the first and second surfaces together. The recessed portions are formed in at least one of the first surface of the first substrate and the second surface of the second substrate. Each recessed portion is a hole configured to take up excess bonding adhesive and, as a non-through hole, does not extend through the entire thickness of a substrate. Each of the recessed portions extends into the first substrate or the second substrate as a rectangular column or an elliptical column and, when a shape of each recessed portion is viewed from the direction orthogonal to the first surface, the shape is approximately isotropic.

A method for producing a silicon substrate comprising a silicon base material; and a wiring formation layer laminated on a base material surface of the silicon base material, and being provided with a wiring member, an electrode member comprising a noble metal, and a close contact member comprising a base metal between the wiring member and the electrode member, wherein the method comprises a step of forming a deposition film by a fluorocarbon gas, in etching of the silicon substrate; and a removal step of removing, by a removal solution, the deposition film formed by the fluorocarbon gas; the removal solution comprises a primary amine and an organic polar solvent; a content of water in the removal solution is 10 mass % or lower; and a content of tetramethylammonium hydroxide in the removal solution is 1 mass % or lower.

A liquid discharge head includes a nozzle plate, an individual liquid chamber, and an actuator. The nozzle plate has a nozzle on a liquid discharge face and a through hole communicating with the nozzle and penetrating the nozzle plate. The nozzle plate includes a substrate including a first silicon layer on a side of the liquid discharge face, a second silicon layer, a first silicon oxide film layer, and a second silicon oxide layer on a surface of the second silicon layer different from a surface of the second silicon layer in contact with the first silicon oxide film layer. A thickness of the first silicon layer is smaller than a thickness of the second silicon layer. A portion of the through hole penetrating the first silicon layer has a smaller diameter than a portion of the through hole penetrating the second silicon layer.

Process for manufacturing a microfluidic device, wherein a sacrificial layer is formed on a semiconductor substrate; a carrying layer is formed on the sacrificial layer; the carrying layer is selectively removed to form at least one release opening extending through the carrying layer; a permeable layer of a permeable semiconductor material is formed in the at least one release opening; the sacrificial layer is selectively removed through the permeable layer to form a fluidic chamber; the at least one release opening is filled with non-permeable semiconductor filling material, forming a monolithic body having a membrane region; an actuator element is formed on the membrane region and a cap element is attached to the monolithic body and surrounds the actuator element.

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.