Patent classifications
B41J2/1628
LIQUID JETTING APPARATUS AND METHOD OF PRODUCING LIQUID JETTING APPARATUS
There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber.
METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE
A method is provided for manufacturing a piezoelectric device including a piezoelectric element that is disposed above a diaphragm and that has a multilayer structure including a first electrode disposed above the diaphragm, a piezoelectric layer disposed on the first electrode, and a second electrode disposed on the piezoelectric layer. The method includes forming the multilayer structure including the first electrode, the piezoelectric layer, and the second electrode above the diaphragm, forming a voltage application electrode extending outwardly from an end of the second electrode to cover a region located above the piezoelectric layer in an inactive section having no second electrode, applying a voltage between the first electrode and the second electrode, and removing the voltage application electrode.
PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND PIEZOELECTRIC ELEMENT DEVICE
Provided are a vibrating plate, a first electrode provided over the vibrating plate, a piezoelectric layer provided over the first electrode, and a second electrode provided over the piezoelectric layer are provided. The piezoelectric layer is interposed between the first electrode and the second electrode. The piezoelectric layer includes an active portion of which at least one end portion is defined by the first electrode, and a non-active portion provided on an outside of the end portion of the first electrode for defining the active portion. The vibrating plate includes a first vibration portion under the non-active portion and a second vibration portion on an outside of the first vibration portion. The second vibration portion includes a taper part having the thickness which is increased toward the first vibration portion.
FLUID EJECTION DEVICE WITH PARTICLE TOLERANT LAYER EXTENSION
In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.
METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD
A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 μm or more or 300 μm or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 μm or more, or at least 5 time the depth when the depth is 300 μm or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.
Method of manufacturing structure and method of manufacturing liquid ejection head
A method of manufacturing a structure includes (1) positioning a first resin layer provided on a first supporting member on a substrate having a through hole, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and (2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer. A first resin layer portion that is above the through hole is removed before or simultaneously with the releasing of the first supporting member.
Liquid jet apparatus and method for manufacturing liquid jet apparatus
There is provided a liquid jet apparatus including a channel substrate having a plurality of pressure chambers and a film covering the plurality of pressure chambers, a piezoelectric layer, a plurality of individual electrodes, a common electrode, and a trace extending from one of the plurality of individual electrodes to pass through between two adjacent individual electrodes of the plurality of individual electrodes. An opening of the piezoelectric layer is provided between the two adjacent individual electrodes, and a metallic film is formed to cover the trace in such an area of the trace as to overlap with the opening positioned between the two adjacent individual electrodes.
INKJET HEAD, METHOD FOR MANUFACTURING SAME, AND IMAGE FORMATION DEVICE
The present invention may provide an inkjet head including a pressure chamber in which an aspect ratio of a partition wall is higher, the inkjet head less likely to be broken at the time of fabrication. An inkjet head of the present invention may include a diaphragm that vibrates by actuation of a piezoelectric body, and a pressure chamber a volume of which fluctuates by vibration of the diaphragm. In the pressure chamber, a region in contact with the diaphragm is divided from an adjacent pressure chamber or flow path by a partition wall formed of metal, and the partition wall has an aspect ratio of 1.3 or higher.
UNSUPPORTED TOP HAT LAYERS IN PRINTHEAD DIES
In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.
LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE APPARATUS
A liquid discharge head includes a pressure chamber in which liquid can be stored, a diaphragm forming a bottom wall of the pressure chamber and having a nozzle opening through which liquid supplied from the pressure chamber is discharged in a first direction, and a drive element on a lower surface of the diaphragm and configured to change a volume of the pressure chamber. A protective film covers the drive element and having a first opening corresponding in position with the nozzle opening, and a liquid repellent film covers the protective film and the lower surface of the diaphragm within the first opening. The liquid repellent film has an opening aligned with the nozzle opening and has the same diameter as the nozzle opening. The liquid repellent film on the drive element is thinner than the liquid repellent film on the lower surface of the diaphragm within the first opening.