A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.

A liquid discharge head comprising a substrate comprising a liquid feeding port and an energy generating element for liquid discharge, and a flow channel member comprising, on the substrate, a discharge port through which a liquid is discharged and a liquid flow channel communicating with both the liquid feeding port and the discharge port, wherein the flow channel member comprises a flow channel member (1) not comprising a surface in contact with the liquid and a flow channel member (2) comprising a surface in contact with the liquid, a film stress S.sub.1 and S.sub.2 of the flow channel members (1) and (2), respectively, satisfy S.sub.1<S.sub.2, a film thickness L.sub.1 and L.sub.2 of the flow channel member (1) and (2), respectively, in a direction perpendicular to the substrate, satisfy L.sub.1<L.sub.2, and satisfying 470 MPa.Math.μm<[L.sub.1×S.sub.1+(L.sub.2−L.sub.1)×S.sub.2]<1200 MPa.Math.μm.

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A microstructure including a minute structural part is manufactured by transferring a laminate including a photosensitive resin composition onto a substrate having an opening and patterning the laminate. The laminate includes a first layer that includes a first resin composition and a second layer that includes a second resin composition, each of the first and second resin compositions being a negative type photosensitive resin composition including a cationically polymerizable compound having an epoxy group. The laminate is transferred such that the second layer faces the substrate. The first resin composition is in a liquid state and the second resin composition is in a liquid state in the course of transferring the laminate.

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

A member transfer method includes sticking a member supported at a support to an object, thinning the support after the sticking of the member to the object, and removing the support from the member after the thinning of the support.

A liquid ejection head includes a substrate provided with an energy-generating element, an ejection orifice forming member that is formed on the substrate and includes an ejection orifice from which liquid is ejected, a reinforcing rib provided in the ejection orifice forming member, and a recess that is formed in the substrate and forms a part of a flow path of liquid, wherein the reinforcing rib is disposed in the inside of the recess.