B41J2/1639

MEMS devices and methods of fabrication thereof

MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.

Complex impedance detection

A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.

LIQUID DISCHARGE HEAD AND METHOD FOR PRODUCING LIQUID DISCHARGE HEAD

A liquid discharge head comprising a substrate comprising a liquid feeding port and an energy generating element for liquid discharge, and a flow channel member comprising, on the substrate, a discharge port through which a liquid is discharged and a liquid flow channel communicating with both the liquid feeding port and the discharge port, wherein the flow channel member comprises a flow channel member (1) not comprising a surface in contact with the liquid and a flow channel member (2) comprising a surface in contact with the liquid, a film stress S.sub.1 and S.sub.2 of the flow channel members (1) and (2), respectively, satisfy S.sub.1<S.sub.2, a film thickness L.sub.1 and L.sub.2 of the flow channel member (1) and (2), respectively, in a direction perpendicular to the substrate, satisfy L.sub.1<L.sub.2, and satisfying 470 MPa.Math.μm<[L.sub.1×S.sub.1+(L.sub.2−L.sub.1)×S.sub.2]<1200 MPa.Math.μm.

LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD

A liquid discharge head including: a substrate having a liquid supply port; a flow channel forming member that is provided on the substrate and has discharge ports for discharging a liquid and a liquid flow channel that makes the liquid supply port and the discharge ports communicate with each other; and a support member that is provided on the substrate and arranged to be in contact with at least one surface of the flow channel forming member, with the one surface not being in contact with the liquid, wherein the flow channel forming member includes a cured product of a first photosensitive resin composition including a photosensitive resin, the support member includes a cured product of a second photosensitive resin composition including the epoxy resin A having a structure represented by formula (a1) or (a2) below in main chain structure:

##STR00001##

where, n.sub.1 and n.sub.2 represent integers of at least 2.

MANUFACTURING METHOD FOR STRUCTURE AND MANUFACTURING METHOD FOR LIQUID EJECTION HEAD

A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.

Method for producing liquid discharge head
11123989 · 2021-09-21 · ·

When the metal constituting a metal layer becoming a diffusion prevention layer is defined as a first metal and the metal constituting a connection terminal is defined as a second metal, in a potential-pH diagram for the first metal-H.sub.2O system, the first metal is present in a passivation area or an insensitive area at a potential of the difference between the standard electrode potentials of the first metal and the second metal in a pH range of 1 to 14.

Liquid ejection head and method of manufacturing liquid ejection head

Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

LIQUID DISCHARGE HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS
20210070048 · 2021-03-11 ·

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

SUBSTRATE WITH ELECTRICAL CONNECTION SECTION, SUBSTRATE FOR LIQUID EJECTION HEAD AND METHODS OF MANUFACTURING THE SAME
20210060938 · 2021-03-04 ·

A substrate with an electrical connection section or a substrate for liquid ejection head comprises a wiring layer, a diffusion prevention layer laid on the wiring layer and a connection member laid on the diffusion prevention layer for establishing an electrical connection to an outside. An insulation layer having a wiring-layer-exposing opening is arranged on the wiring layer and the diffusion prevention layer is arranged in the opening, while the connection member is arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer.

Process for forming inkjet nozzle chambers
20210031512 · 2021-02-04 ·

An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall extending between the floor and the roof The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and an actuator for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a main chamber inlet defined in the floor; and a baffle structure partitioning the main chamber to define the firing chamber and the antechamber, the baffle structure extending between the floor and the roof. The firing chamber and the antechamber have a common plane of symmetry.