Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of aback surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

In a substrate of a liquid ejection head, there are formed a first through-hole which constitutes a liquid supply path, and a second through-hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through-hole has a first hole having a first opening and a second hole having a second opening, and the second through-hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

A liquid discharge head that can prevent occurrence of cracks generated by a connection between an electrode pad and a wiring while reducing a manufacturing cost is provided. A bonding portion and a non-bonding portion are disposed at positions where the bonding portion and the non-bonding portion overlap an electrode and a coating film but do not overlap a through hole in a planar view of a liquid discharge head substrate.

When the metal constituting a metal layer becoming a diffusion prevention layer is defined as a first metal and the metal constituting a connection terminal is defined as a second metal, in a potential-pH diagram for the first metal-H.sub.2O system, the first metal is present in a passivation area or an insensitive area at a potential of the difference between the standard electrode potentials of the first metal and the second metal in a pH range of 1 to 14.

An actuator device includes: an actuator including a first contact; and a wire member including a second contact connected to the first contact with a conductive adhesive including a conductive particle. One of the first contact and the second contact is a particular contact. The other of the first contact and the second contact is a specific contact. At least two protrusions and at least one recess are formed on and in the particular contact. The at least two protrusions are arranged in a first direction. The at least one recess is interposed between the at least two protrusions. The particular contact is joined to the specific contact with the conductive adhesive provided in the at least one recess, in a state in which each of the at least two protrusions is in contact with the specific contact.

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

Methods for manufacturing a microfluidic delivery device comprising a semiconductor structure, such as silicon, are provided. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses semiconductor material, such as silicon, to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.

An ink jet recording head includes an ejection chip in which a plurality of ejection orifices performing ejection are arranged; an external wiring board including an external wiring for applying an electric signal to the ejection chip from an outside; an electrical bonding portion where the external wiring of the external wiring board and the ejection chip are electrically bonded to each other; and a resin sealing portion that seals the electrical bonding portion, in which a corner of the external wiring board where a first end surface on an ejection chip side and a side end surface connected to the first end surface intersect has a chamfered portion which is chamfered, and the chamfered portion is positioned within a width of the ejection chip in an ejection orifice arrangement direction.

To satisfactorily seal an electrical connection portion between an element substrate and a wiring substrate, and suppress a decrease in yield and an increase in manufacturing cost. A liquid ejecting head includes an element substrate having a plurality of energy generating elements and a plurality of electrodes, and a wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.