An oriented piezoelectric film comprises perovskite type crystals expressed by formula (1) shown below:
(1−x)NaNbO.sub.3-xBaTiO.sub.3 (0.01≤x≤0.40)  (1)
and (111) oriented in pseudocubic crystal notation.

A hydrophilic coating material including an alginic acid compound and a resin, in which the alginic acid compound is granulated and dispersed in the resin. In a coating film using the material, it is preferred that the granulated alginic acid compound is exposed on the surface. Such a hydrophilic coating film is suitable as a hydrophilization treatment film of a nozzle face surface of an inkjet recording head.

A method for producing a laminate of a cured material from a photosensitive resin composition (1) and a photosensitive resin composition (2), wherein the method includes a step of obtaining a laminated material by laminating the composition (2) onto the composition (1); a step of subjecting the laminated material to photoexposure to obtain a photocured material; a step of developing the photocured material to obtain a developed material; and a step of heating the developed material to obtain a laminate, wherein the photoexposure dose required to cure the composition (2) is smaller than the dose required to cure the composition (1), and wherein the composition (1) contains an epoxy resin (1) having a weight-average molecular weight Mw of 5,000 to 600,000, a softening point of at least 140° C., and an epoxy equivalent weight of not more than 2,300.

An element substrate used in a liquid discharge head that discharges liquid to a recording material includes a substrate, an energy generating element that generates energy used to discharge the liquid, circuit wiring that has an electrode portion for external electrical connection and that drives the energy generating element, and that is implemented on the substrate, a first protective film layer that has an opening portion for exposing the electrode portion and that covers the circuit wiring, an electroplating ground layer formed on the electrode portion, and an electroplated bump layer made of a metal material formed on the electroplating ground layer. A bent portion is formed in the first protective film layer by the first protective film layer covering a protruding portion that the circuit wiring has. A second protective film layer is formed on the first protective film layer and covers the bent portion.

A liquid ejecting head includes a diaphragm, a first electrode, a piezoelectric layer, and a second electrode in this order in a first direction, and ejects liquid. The second electrode includes a first portion that is next to the piezoelectric layer in the first direction and is electrically conductive. A length in the first direction is defined as a thickness. One position in a second direction intersecting with the first direction is defined as a first position. Another one position is defined as a second position that is closer to an end of the second electrode in the second direction than the first position is. Given the definition, the thickness of the first portion at the second position is less than the thickness of the first portion at the first position.

A liquid discharge head comprising a substrate comprising a liquid feeding port and an energy generating element for liquid discharge, and a flow channel member comprising, on the substrate, a discharge port through which a liquid is discharged and a liquid flow channel communicating with both the liquid feeding port and the discharge port, wherein the flow channel member comprises a flow channel member (1) not comprising a surface in contact with the liquid and a flow channel member (2) comprising a surface in contact with the liquid, a film stress S.sub.1 and S.sub.2 of the flow channel members (1) and (2), respectively, satisfy S.sub.1<S.sub.2, a film thickness L.sub.1 and L.sub.2 of the flow channel member (1) and (2), respectively, in a direction perpendicular to the substrate, satisfy L.sub.1<L.sub.2, and satisfying 470 MPa.Math.μm<[L.sub.1×S.sub.1+(L.sub.2−L.sub.1)×S.sub.2]<1200 MPa.Math.μm.

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

Provided is an inkjet head containing a nozzle plate having at least a substrate, wherein the nozzle plate has a liquid-repellent layer on an outermost surface of the substrate on an ink ejection surface side; a liquid-repellent layer base film is provided between the substrate and the liquid-repellent layer; and the liquid-repellent layer base film contains at least silicon (Si) and carbon (C), and having a maximum peak P of a binding energy of a Si2p orbital of a surface portion measured by X-ray photoeletron spectroscopy is in the range represented by the following Formula (1), Formula (1): 99.6 (eV)≤P≤101.9 (eV).

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.

A microstructure including a minute structural part is manufactured by transferring a laminate including a photosensitive resin composition onto a substrate having an opening and patterning the laminate. The laminate includes a first layer that includes a first resin composition and a second layer that includes a second resin composition, each of the first and second resin compositions being a negative type photosensitive resin composition including a cationically polymerizable compound having an epoxy group. The laminate is transferred such that the second layer faces the substrate. The first resin composition is in a liquid state and the second resin composition is in a liquid state in the course of transferring the laminate.