A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

A liquid ejection head including a base substrate, an ejection port to eject a liquid, a heating element formed above the base substrate that heats the liquid to eject the liquid from the ejection port, a temperature detection element formed above the base substrate that detects a temperature of the liquid, a wiring layer connected to the heating element, a protective layer formed on the base substrate that protects the heating element and the wiring layer from the liquid, and a liquid supply port that penetrates the base substrate and supplies the liquid to the ejection port. When viewed in a direction perpendicular to the base substrate, the temperature detection element is disposed between the heating element and the liquid supply port, and the temperature detection element is formed on the protective layer.

An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.

A method for cleaning a liquid ejection head, including a flow path forming member forming a liquid flow path, a heat generating resistive element, and a coating layer covering the heat generating resistive element and in contact with the liquid, in which the heat generating resistive element is made to generate heat and the liquid is made to be ejected from ejection ports, the method including: applying a voltage to the coating layer to produce an electrochemical reaction between the coating layer and the liquid, and causing the coating layer to be eluted into the liquid, thereby removing kogation deposited on the coating layer; and causing the heat generating resistive element to generate heat and causing the liquid to be ejected from the ejection ports while a voltage is applied to the coating layer continuously or intermittently, thereby eliminating air bubbles generated due to the electrochemical reaction.

In one embodiment, a printhead includes a substrate comprising a single fluid slot with sidewall surfaces. The printhead also includes a plurality of fluid chambers in fluid communication with the fluid slot. The printhead includes a membrane disposed between the fluid slot and the fluid chambers. The membrane comprises membrane side surfaces that form fluid feed holes to provide the fluid communication between the fluid slot and the fluid chambers. A protective coating is disposed on each of the surfaces.

An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.

The present disclosure is directed to a microfluidic die that includes a first larger heater and a second smaller heater is a single chamber. The first heater is configured to form a primary bubble that ejects fluid from a nozzle associated with the chamber. The second heater is configured to form a secondary bubble to prevent blow back caused when the primary bubble bursts and ejects fluid from the nozzle. The first and second heater may be coupled to a single input trace and a single ground trace.

The present disclosure provides an chip structure. The inkjet chip structure includes a substrate layer, a heating resistor, and a protective layer. The heating resistor is disposed on the substrate layer. The protective layer covers the heating resistor. The heating resistor includes a heating resistance layer and a dielectric layer. The protective layer includes a plurality of recesses disposed above the dielectric layer. A distance is formed from a bottom of the recess to a top of the heating resistance layer, and the distance is ranged from 1.510.sup.7 m to 1.410.sup.6 m. In addition, a contact layer is arranged around the heating resistance layer. The contact layer is rectangular in shape when viewed from a top view. There are at least two contact layers in each direction from the heating resistance layer, and all the contact layers have one side length with a fixed size.

A liquid ejection head includes a first individual ejection unit, a second individual ejection unit, and a common flow passage for supplying liquid. The first individual ejection unit and the second individual ejection unit each include an ejection port, a pressure chamber, a first energy generating element that is provided in the pressure chamber, an individual flow passage that communicates with the pressure chamber, and a second energy generating element that is provided in the individual flow passage. The liquid ejection head is characterized in that the first and second energy generating elements in each ejection unit are controlled differently for each individual ejection unit at a common driving timing, by a common driving pulse.