A method for manufacturing a liquid discharge head comprising: a substrate, a protective layer covering at least a part of the substrate, and a laminate member formed on the protective layer, wherein the method comprises steps of: forming the protective layer on at least a part of the substrate; forming the laminate member on the protective layer with a part of the protective layer exposed, the protective layer comprises at least Si and C, a content of oxygen in a bulk of the protective layer is less than 20 atomic % in terms of an element composition ratio, a modified layer with a content of oxygen of 20 atomic % or more in terms of an element composition ratio is present on a surface of the protective layer, and a thickness of the modified layer between the protective layer and the laminate member is 3.40 nm or less.

A liquid discharge head includes a plurality of discharge elements, a plurality of driving elements, a plurality of control circuits, a first ground wiring and a first power supply wiring configured to supply power to the plurality of discharge elements and the plurality of driving elements, and a second ground wiring and a second power supply wiring configured to supply power to the plurality of control circuits. The first ground wiring and the first power supply wiring include, in a first conductive layer of a plurality of conductive layers, a first wiring group extending in a first direction, and in a second conductive layer, a second wiring group extending in a second direction which intersects with the first direction. The second power supply wiring is arranged on one of the first conductive layer and the second conductive layer.

A fluidic die includes a substrate and a thermal sensor arranged on a membrane region of the substrate. The substrate includes a fluid slot formed in a back side of the substrate, while the membrane region is positioned between the fluid slot and a front side of the substrate. The substrate also includes a plurality of fluid feed holes in the membrane region, where each fluid feed hole is in communication with the fluid slot and the front side of the substrate.

An element substrate, according to an embodiment of this present invention, capable of detecting the behavior of a liquid at a high sensitivity, comprises: a first electrothermal transducer configured to generate heat to discharge a liquid; at least one temperature detection element arranged near the first electrothermal transducer; and a second electrothermal transducer configured to generate heat in association with a temperature detection operation by the at least one temperature detection element.

A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

A liquid ejecting apparatus with a recording element substrate including an ejection port that ejects liquid, and a heating element that heats the liquid in order to eject the liquid from the ejection port; and at least a first temperature detecting element and a second temperature detecting element. The first temperature detecting element and the second temperature detecting element are formed at target positions centered on the center of the heating element when the recording element substrate is viewed in plan view.

Systems and methods are provided for cover plates for printheads. One embodiment is an apparatus that includes a cover plate for a printhead. The cover plate includes multiple layers of electrically conductive material, a layer of nonconductive ferrite that is sandwiched between the multiple layers, and at least one connector that penetrates through the multiple layers and the layer of nonconductive ferrite to form a conductive pathway for electric current between the multiple layers through the layer of nonconductive ferrite. The cover plate also includes at least one opening that penetrates through the multiple layers and the layer of nonconductive ferrite, and that is configured to align with nozzles of the printhead.

A liquid ejection head including a base substrate, an ejection port to eject a liquid, a heating element formed above the base substrate that heats the liquid to eject the liquid from the ejection port, a temperature detection element formed above the base substrate that detects a temperature of the liquid, a wiring layer connected to the heating element, a protective layer formed on the base substrate that protects the heating element and the wiring layer from the liquid, and a liquid supply port that penetrates the base substrate and supplies the liquid to the ejection port. When viewed in a direction perpendicular to the base substrate, the temperature detection element is disposed between the heating element and the liquid supply port, and the temperature detection element is formed on the protective layer.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

The present disclosure provides a thermal print head and a method of fabricating the thermal print head. The thermal print head includes a substrate made of a semiconductor material and having a main surface and a convex portion, a resistor layer including a plurality of heat generating portions on the convex portion, and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. At least one of two ends of the convex portion in the main scanning direction forms a third inclined surface connected to the main surface and the first inclined surface, and a fourth inclined surface connected to the main surface and the second inclined surface.