In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

A liquid ejection head being for liquid suction and wipe operations and enabling diaphragm plates to achieve proper amounts of displacement with low drive voltage includes first and second substrates. Ejection ports for ejecting liquid are provided at a flat first surface of the first substrate. Drive elements are provided on a second surface of the first substrate. The second substrate is joined to the second surface of the first substrate, forming pressure chambers configured to be supplied with liquid. Pressure-chamber forming portions of the first substrate form the diaphragm plates. The liquid in the pressure chambers is ejected from the ejection ports upon displacement of the diaphragm plates. The second surface of the first substrate includes the drive elements and is uneven. In the diaphragm plates, second regions surrounding first regions provided with the ejection ports have lower rigidity than the first regions.