An ionic conductor includes an inorganic oxychloride compound with a chemical composition of (Fe.sub.1-xM.sub.x)O.sub.1-y(OH).sub.yCl.sub.1-x where M is selected from at least one of Mg and Ca, and x is greater than 0 and less than or equal to 0.25, y is greater than or equal to 0 and less than or equal to 0.25. The inorganic oxychloride compound has a thermal decomposition start temperature of about 410° C. and x-ray diffraction peaks (2θ) between about 20.79° and about 22.79°, between about 30.03° and about 32.03°, between about 39.47° and about 41.47°, and between about 76.44° and about 78.44°.

Provided is a hydrophobic silica aerogel blanket comprising holes, so that the diffusion of a surface modifier is facilitated in a blanket during a surface modification process to improve the efficiency of surface modification. Accordingly, the hydrophobic silica aerogel has not only excellent physical properties such as specific surface area and thermal conductivity, but also a controlled degree of hydrophobicity, and thus, can have high hydrophobicity.

The present invention provides an aerogel blanket including a blanket base, aerogel coupled on the surface of the blanket base, and aerogel located at a space between the blanket bases, the aerogel coupled on the surface of the blanket base is 50 wt % based on the total weight of aerogel, wherein the aerogel blanket has the number of aerogel particles separated from the aerogel blanket ranging from 13,600 to 90,000 per ft.sup.3, when vibrating the aerogel blanket at a frequency of 1 Hz to 30 Hz for 2 hours to 10 hours.

A structure body includes a free-standing structure including a fibrous member and/or a shell. The fibrous member and/or a shell are each a layered body formed of at least one light-absorbing layer and at least one dielectric layer. The light-absorbing layer includes a light-absorbing material that has an absorption in a visible light region, and the dielectric layer includes a dielectric material. The fibrous member and/or the shell have a three-dimensionally continuous configuration.

The present disclosure provides a precursor solution of a semiconductor electrothermal film, which comprises component A, component B, and component C. The component A comprises the following components by weight: 2-10 parts of tin tetrachloride pentahydrate, 3-6 parts of stannous chloride and 0.3-1 part of glycerol, also comprises a pH regulator, the pH of the component A is 4.7-6.2; the component B comprises the following components by weight: 5-10 parts of conductivity regulator, the conductivity regulator is selected from a group consisting of antimony trichloride dihydrate, bismuth trioxide, aluminum oxide and thallium dioxide, 0.6-1 part chlorinated aluminum and a mixture thereof, also comprises a pH regulator, the pH of the component B is 4.7-5.0; the component C comprises the following components by weight: 0.5-0.7 parts of tin oxide, 0.8-1.5 parts of bismuth oxide and 15-25 parts of ethanol; also comprises 15-30 parts of distilled water. A preparation method of electrothermal film and electrothermal structure is further provided. The obtained semiconductor electrothermal film has good nature of resistance to sudden temperature changes, good temperature stability, attenuation resistance, fast heating speed, and high temperature resistance.

A method for graphene functionalization that preserves electronic properties and enables nanoparticles deposition comprising providing graphene, functionalizing the graphene via non-covalent or covalent functionalization, rinsing the graphene, drying the graphene, and forming functionalized graphene wherein the functionalized graphene preserves electronic properties and enables nanoparticles deposition. A functionalized graphene wherein the graphene functionalization preserves electronic properties and enables nanoparticles deposition.

The invention relates to a millimeter-sized bulk spa amorphous carbon material and a method of preparing the same, and the method comprises a step of performing a high-temperature and high-pressure (HTHP) treatment on C.sub.60 powder at a temperature of 450-1100° C., preferably 700-1000° C., more preferably 900-1000° C., and most preferably 1000° C., and a pressure of 20-37 GPa, preferably 20-30 GPa, and most preferably 27 GPa, so as to obtain the millimeter-sized bulk sp.sup.3 amorphous carbon material. The sp.sup.3 carbon content in the amorphous carbon material is adjustable by changing the temperature and pressure conditions, so that the sp.sup.3 content is greater than 80%, and the sp.sup.3 content of high-quality samples is close to 100%. The optical band gap and thermal conductivity of the series of amorphous carbon materials can be effectively adjusted. The obtained series of amorphous carbon materials have ultra-high hardnesses, high thermal conductivities, adjustable band gaps (1.90-2.79 eV) which exceed the ranges of the band gaps of amorphous silicon and germanium. As a result, a new space is opened up for the application of amorphous materials.

A graphite-copper composite material that includes a copper layer having an average thickness of 15 μm or less and scaly graphite particles laminated with the copper layer interposed therebetween. The graphite-copper composite material has a copper volume fraction of 3 to 20%. The graphite-copper composite material further has: (A) copper crystal grains of the copper layer having an average grain size of 2.8 μm or less, a mass fraction of Al of less than 0.02%, and a mass fraction of Si of less than 0.04%, or (B) an interfacial gap of the copper layer and the scaly graphite particles of 150 nm or less.

A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body includes silicon or a silicon alloy, wherein the average grain size of the crystal grains forming the polycrystalline body is 1 μm or less, and wherein nanoparticles including one or more of a carbide of silicon, a nitride of silicon, and an oxide of silicon are present at a grain boundary of the grains.

A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.