The invention relates to a method for locally deforming a flat surface of a substrate made of glass or a glass-ceramic, and to an operating element that can be produced with the method. The method is characterised by the following method steps: applying heat exclusively within a locally limited region via the surface of the substrate by means of laser radiation, gas flame, infrared radiation, electrical microwaves or plasma discharge directed towards the surface of the substrate, in such a way that the substrate is softened at least on the surface within the locally limited region; applying a force acting on the softened surface within the locally limited region, such that the softened surface of the substrate is deformed within the region; and cooling the substrate to obtain a surface that is deformed and set within the local region.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

Disclosed herein are glass-based articles having a first surface having an edge, wherein a maximum optical retardation of the first surface is at the edge and the maximum optical retardation is less than or equal to about 40 nm and wherein the optical retardation decreases from the edge toward a central region of the first surface, the central region having a boundary defined by a distance from the edge toward a center point of the first surface, wherein the distance is ? of the shortest distance from the edge to the center point.

Disclosed herein are glass-based articles having a first surface having an edge, wherein a maximum optical retardation of the first surface is at the edge and the maximum optical retardation is less than or equal to about 40 nm and wherein the optical retardation decreases from the edge toward a central region of the first surface, the central region having a boundary defined by a distance from the edge toward a center point of the first surface, wherein the distance is ? of the shortest distance from the edge to the center point.

Provided is a glass film ribbon manufacturing device (1), including: a transverse conveyance unit (4), which is configured to convey a glass film ribbon (G) in a transverse direction; and a cleaving unit (5), which is arranged on a conveyance path of the transverse conveyance unit (4), and is configured to cleave the glass film ribbon (G) along a preset cleaving line extending in a longitudinal direction, the transverse conveyance unit (4) including a wrinkle-smoothing unit (14) configured to smooth a wrinkle generated in the glass film ribbon (G) before the glass film ribbon (G) is cleaved by the cleaving unit (5).

Provided is a glass film ribbon manufacturing device (1), including: a transverse conveyance unit (4), which is configured to convey a glass film ribbon (G) in a transverse direction; and a cleaving unit (5), which is arranged on a conveyance path of the transverse conveyance unit (4), and is configured to cleave the glass film ribbon (G) along a preset cleaving line extending in a longitudinal direction, the transverse conveyance unit (4) including a wrinkle-smoothing unit (14) configured to smooth a wrinkle generated in the glass film ribbon (G) before the glass film ribbon (G) is cleaved by the cleaving unit (5).

A method forming an elastic undulated layer locally lying on a substrate from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method including: melting a foundation for a duration of at least 50 ns, the foundation thickness being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting generating a simultaneous deformation, by forming wrinkles, of the elastic layer and the foundation and accompanied by localized adherent contact between the elastic layer and the rigid substrate in zones separating regions of the foundation; solidifying the foundation to bring it back to the solid state; removing the foundation brought back to the solid state to suspend a layer above the substrate outside the zones of localized adherent contact, the suspended layer being undulated in accordance with the wrinkles.

A method forming an elastic undulated layer locally lying on a substrate from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method including: melting a foundation for a duration of at least 50 ns, the foundation thickness being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting generating a simultaneous deformation, by forming wrinkles, of the elastic layer and the foundation and accompanied by localized adherent contact between the elastic layer and the rigid substrate in zones separating regions of the foundation; solidifying the foundation to bring it back to the solid state; removing the foundation brought back to the solid state to suspend a layer above the substrate outside the zones of localized adherent contact, the suspended layer being undulated in accordance with the wrinkles.

A glass substrate molding method includes: preparing a rotatable or wheelable molding die having a die surface and contacting the die surface with one of a pair of principal surfaces of a glass substrate made of a glass material containing an alkali metal oxide, the die having conductivity; keeping the one of principal surfaces contacted with the die surface at a temperature over 100 C. and equal to or lower than Tg+50 C.; applying direct-current voltage to the substrate to be higher voltage on the contacted one of principal surfaces than voltage on an opposite surface of the contacted one of principal surfaces; and rotating or wheeling the die and simultaneously moving the die or the substrate in a direction parallel to the contacted one of principal surfaces in conformity with rotation or wheeling speed of the die, to mold the contacted one of principal surfaces of the substrate.